Brooks Instrument has opened a new manufacturing facility in Penang, Malaysia, significantly increasing its operational footprint in Asia-Pacific for producing mass flow controllers (MFCs).
Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
Kneron, the San Diego-based full-stack AI company, today announced $49M in strategic funding from investors including Foxconn and Alltek, bringing their total Series B financing to $97 million.
FMI Analyst View: “Shaping the Future of Protection: Hermetic Packaging Solutions”
The hermetic packaging market is poised to increase at a 4.2% CAGR from 2023 to 2033, acquiring a market value of US$ 5.2 billion by the end of 2033, up from US$ 3.4 billion in 2023.
KemLab Inc. Applauds CHIPS Act’s Commitment to Strengthening Semiconductor Supply Chain
KemLab announced its intention to apply for the Fall 2023 funding under the CHIPS Act.
Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases.
Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification
Cadence Design Systems, Inc. today announced its digital and custom/analog flows have achieved certification for TSMC’s latest N2 Design Rule Manual (DRM).
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process
Keysight Technologies, Inc., Synopsys, Inc, and Ansys announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
GlobalFoundries and Microchip Announce Microchip’s 28nm SuperFlash Embedded Flash Memory Solution in Production
GlobalFoundries and Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process.
Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.
GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
GlobalFoundries announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
