Pragmatic Semiconductor Ltd. today announced the launch of Pragmatic FlexIC Platform Gen 3, offering a 10x digital power and 3x digital area improvement over the previous generation.
Axelera AI Secures up to €61.6 Million Grant to Develop Scalable AI Chiplet for High-Performance Computing
Axelera AI, the provider of purpose-built AI hardware acceleration technology for generative AI and computer vision inference at the edge, unveiled Titania, a high-performance, energy efficient and scalable AI inference chiplet.
SEMI Commends the European Water Resilience Strategy
SEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the European Commission’s unveiling of the European Water Resilience Strategy as a positive and fundamental step to enhance water efficiency, resilience and sustainability across Europe.
ETH Zurich and Polariton Technologies Achieve Record- Breaking Electro-Optic Bandwidth with Plasmonic Modulators
Polariton Technologies AG, an ETH Zurich spin-off, together with ETH Zurich have set a new benchmark in the field of electro-optic (EO) modulators with their latest innovation.
Growing Colorado’s Semiconductor and Advanced Industry Ecosystems: Five New Market Study Grants Awarded Statewide
Today, the Global Business Development Division of the Colorado Office of Economic Development & International Trade (OEDIT) announced the latest market study grant recipients of the Colorado CHIPS Community Support Program.
Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance
This MoU marks a significant step forward for Tata Electronics, Himax, and PSMC in expanding their market outreach and jointly exploring the growing market of display semiconductors and ultralow power AI sensing in India as well as globally.
Micron Appoints Mark Liu and Christie Simons to Board of Directors
Micron Technology Inc. today announced it has appointed two experienced business leaders, Mark Liu and Christie Simons, to its board of directors.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
MSTC 2025 to Spotlight Strategies for Bringing MEMS and Sensors Advancements to Market
MEMS and Sensors Technical Congress (MSTC) 2025, the premier technical event on designing, building, and using sensors, will gather industry leaders from across the MEMS and sensors supply chain from March 26-27 at the Georgia Institute of Technology.
Saras Micro Devices Announces Participation in CHIPS National Advanced Packaging Manufacturing Program Initiatives
Saras Micro Devices today announced its participation in two significant projects funded by the U.S. Department of Commerce CHIPS National Advanced Packaging Manufacturing Program (NAPMP).
