Rhombus Energy Solutions today announced that Wolfspeed, Inc. will supply its EV2flex line of charging infrastructure products with Silicon Carbide MOSFETs, which will offer the products greater efficiency, higher power density and faster charging times.
Semiconductor Materials at a Critical Tipping Point
TECHCET, the electronic materials advisory firm providing business and technology information, held its highly successful and well-attended 2022 Critical Materials Conference in Chandler, Arizona on April 28th and 29th.
STMicroelectronics Launches New MDmesh MOSFETs
STMicroelectronics’ STPOWER MDmesh M9 and DM9 N-channel super-junction multi-drain silicon power MOSFETs are ideal for switched-mode power supplies (SMPS) in applications from data-center servers and 5G infrastructure to flat-panel televisions.
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications.
Steven Laub Joins Rambus Board of Directors
Rambus Inc., a chip and silicon IP provider making data faster and safer, today announced the appointment of Steven Laub to its Board of Directors.
Infineon Moves Austin Production Site to Renewable Power
Infineon Technologies AG today announced that it has switched the operation of its Austin, Texas semiconductor factory, also known as “Fab25,” to 100 percent renewable power.
VueReal Presents Its Full-Colour AR Solution and High-Yield, High-Throughput Micro-Printing at SID Display Week 2022
VueReal will present its self-aligned process and super high-resolution colour AR demonstration at SID display week 2022.
SIA, FIRST Announce Partnership to Strengthen U.S. STEM Workforce
Partnership will focus on enhancing talent pipeline to equip students with skills needed for science and technology careers.
A New Age of 2.5D Materials
2.5-dimensional materials promise new applications for artificial intelligence, electronics, automobiles and the energy sector.
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
ACM Research, Inc. today announced that a volume purchase contract has been received from a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools, which are scheduled to be delivered later in 2022 and 2023.
