Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Metal Mix and Match: An Unexpected Discovery Could Improve the Crystallinity of Coordination Nanosheets

Scientists develop a simple strategy to enhance the structural properties of coordination nanosheets by mixing two metal ion solutions together, using a powerful organic ligand.

Intel Names Christoph Schell Executive Vice President and Chief Commercial Officer

Schell joins Intel to help drive customer and partner success and capitalize on the largest opportunity in the company’s history.

LET-a CeMAT ASIA Event 2022

LET-a CeMAT ASIA event is the biggest intelligent logistics equipment and technology trade fair in South China.

Revasum Secures US$8M Growth Capital Facility from SQN

Global semiconductor technology and equipment firm, Revasum, Inc. announced that it has secured a growth capital facility from SQN Venture Partners, LLC.

Advanced Packaging Market Worth $55B, Globally, by 2028 at 8% CAGR

The advanced packaging market to grow at a CAGR of 8% to reach $55 billion by 2028 from ~$30 billion in 2020.

MSTC 2022 to Showcase Latest MEMS and Sensors Advances Driving Medical and Mobility Innovations

Advances driving the next generation of medical and mobility applications will take center stage at the SEMI MEMS and Sensors Technical Congress (MSTC 2022), April 26-27, 2022, as industry visionaries and experts gather to discuss the latest MEMS and sensors trends and innovations.

A Possible Paradigm Shift Within Piezoelectricity

Researchers have found a new method to induce the piezoelectric effect in materials that are otherwise not piezoelectric. It can pave the way for new uses and more environmentally friendly materials.

ACM Research Receives Orders for Ultra ECP map and Ultra ECP ap Copper Plating Systems

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced purchase orders for 13 Ultra ECP map and 8 Ultra ECP ap copper plating systems, of which 10 tools are repeat orders from a top-tier Chinese foundry.

Busch Vacuum Solutions Opens Service Center in Pennsylvania

Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors, and systems, announced the opening of their new 19,000 square foot Service Center located outside Philadelphia, Pennsylvania USA.

Magnachip Enters Full-Scale Mass Production of OLED DDIC for OLED TVs

Magnachip Semiconductor Corporation announced today that the company has commenced full-scale mass production of an organic light-emitting diode display driver integrated circuit (OLED DDIC) for OLED TVs.