ADVA will use POET’s multi-engine transmit and receive chips in an innovative pluggable solution that packs the functionality of four independent 100Gbit/s interfaces into a single QSFP-DD housing.
SEMI Announces Election of Mary Puma, Axcelis Technologies CEO, as International Board Chair
SEMI today announced that its International Board of Directors has elected Mary Puma, president and CEO of Axcelis Technologies, as its new chairperson, effective immediately, in accordance with the association’s by-laws.
Silanna UV Introduces TO-Can Package Format for 235nm and 255nm UV-C LEDs
Silanna UV announced the release of two new products in its SF1 235nm and SN3 255nm series of UV-C LEDs: the SF1-3T9B5L1 and the SN3-5T9B5L1.
proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit
proteanTecs announced today that the company will exhibit and present at the first annual Chiplet Summit.
Vertical Electrochemical Transistor Pushes Wearable Electronics Forward
Biomedical sensing is one application of efficient, low-cost transistors.
Foundry Revenue Is Forecasted to Drop by 4% YoY for 2023
TrendForce’s recent analysis of the foundry market reveals that demand continues to slide for all types of mature and advanced nodes.
Quantum Simulator Enables First Microscopic Observation of Charge Carriers Pairing
A team of researchers at the Max Planck Institute of Quantum Optics has for the first time monitored in an experiment how holes (positive charge carriers) in a solid-state model combined to form pairs. This process could play an important role in understanding high-temperature superconductivity.
Akoustis Receives First High-Volume 5G Mobile XBAW Filter Order from Tier-1 RF Component Company
The filter solution leverages one of Akoustis’ new wafer-level-packages (WLP), developed and manufactured in its Canandaigua, New York fab.
Melexis to Invest 70M EUR in Facility Expansion in Kuching, Malaysia
Melexis, a global supplier of micro-electronic semiconductor solutions, is expanding its facility in Kuching, Malaysia.
New All-in-One Hybrid Power Drive Module Solution from Microchip
The highly integrated and configurable three-phase power module is the first variant of the new family and can be customized using silicon carbide or silicon, reducing power solution size and weight for electric aircraft.
