Mitsubishi Chemical Corporation will invest over 10 million Euro for an expansion of its precision cleaning facility in Dresden, Germany.
RSBG Advanced Manufacturing Technologies GmbH Acquires Majority of Shares from Osiris International GmbH
RSBG Advanced Manufacturing Technologies GmbH (RSBG AMT), an investment company founded in 2019 and a wholly owned subsidiary of RSBG SE headquartered in Essen, Germany, holds 75.1% of Osiris International GmbH, headquartered in Singen, Germany, with retroactive effect from Jan. 1, 2021.
ERS Now Offers its Technology for Fan-out Debonding and Warpage Adjustment in a Fully-Automatic Machine for Panels up to 650 x 650 mm
ERS electronic, a developer of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging
YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology
YES (Yield Engineering Systems, Inc.), a manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels.
Fraunhofer ENAS Successfully Manufactures Ultra-Thin and Highly Flexible Parylene-Based Printed Circuit Boards with Several Metallization Layers
Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.
Partnership Between SUSS MicroTec and SET to Develop a Combined Equipment Solution for 3D Chip Integration
SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.
Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs.
Classiq Unveils Groundbreaking Capabilities for Its Quantum Algorithm Design Platform
Users can now integrate proprietary functionality with extensive pre-written functional models to create sophisticated and optimized quantum circuits that could not be designed otherwise.
Gwangju Institute of Science and Technology Makes Breakthrough on New Electronic Material
New research reveals the easy tunability of a perovskite material, opening doors to its widespread use in next generation electronics.
Smart Textiles: High Performance, Breathable Fabric to Power Small Electronics
Scientists have created a new triboelectric fabric that generates electricity from the movement of the body while remaining flexible and breathable.
