OMNIVISION announced today the automotive industry’s most advanced AI-enabled application-specific integrated circuit (ASIC) that can seamlessly and simultaneously power dedicated driver and occupant monitoring systems.
U.S. Department of Defense and GlobalFoundries Partner to Secure Supply of Chips Critical to National Security Systems
Public-private partnership provides strategic supply of U.S.-made and secure semiconductors for the nation’s most sensitive defense and aerospace applications, boosts supply of feature-rich chips for critical infrastructure commercial applications.
Leopard Imaging Collaborates with OMNIVISION on AI Imaging Solutions
Leopard Imaging Inc. announced today a collaboration with OMNIVISION to launch artificial intelligence (AI) camera solutions for autonomous machines, supporting the OA8000 and OAX8000 camera video processors.
NanoScientific Symposium 2022 Now Open for Registration
The NanoScientific Symposium 2022, an international event that brings together researchers and entrepreneurs in the fields of nanoscience and nanotechnology, will begin accepting registrations on April 26, 2022.
Busch Celebrates Grand Opening of New Service Location in Pennsylvania
Servicing all equipment including industrial and medium high vacuum pumps.
Intel Has 13 Talks at the VLSI Symposia in June, Including Intel 4
The VLSI Symposia are coming up on June 12 – 17, at the Hilton Hawaiian Village in Honolulu, and recently their media associates released the tipsheet describing some of the upcoming papers.
Worldwide Silicon Wafer Shipments Edge Higher to New Record in First Quarter 2022, SEMI Reports
Worldwide silicon wafer area shipments in the first quarter of 2022 surpassed the previous record high set in the third quarter of 2021, rising 1% quarter-over-quarter to 3,679 million square inches.
EY Announces Dr. Subodh Kulkarni of CyberOptics Corporation as an Entrepreneur Of The Year 2022 Heartland Award Finalist
Ernst & Young LLP (EY US) announced that Dr. Subodh Kulkarni, President and CEO of CyberOptics Corporation, was named an Entrepreneur Of The Year 2022 Heartland Award finalist.
Dow’s New Thermally Conductive Silicone Encapsulant wins BIG Innovation and Edison Awards
Dow globally introduced today DOWSIL TC-6015 Thermally Conductive Encapsulant, an advanced, proven, silicone-based solution that provides exceptional thermal management for power electronics applications.
Light-Infused Particles Go the Distance in Organic Semiconductors
Polaritons offer the best of two very different worlds. These hybrid particles combine light and molecules of organic material, making them ideal vessels for energy transfer in organic semiconductors. They are both compatible with modern electronics but also move speedily, thanks to their photonic origins.
