Partnership builds on a multi-year collaboration to accelerate industry innovation in enabling advanced packaging and high-performance-compute.
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
AI Slashes Cost and Time for Chip Design, But That’s Not All
Researchers at Princeton Engineering and the Indian Institute of Technology have harnessed artificial intelligence to take a key step toward slashing the time and cost of designing new wireless chips and discovering new functionalities to meet expanding demands for better wireless speed and performance.
Marvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Accelerators
Marvell Technology, Inc. today announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.
DreamBig Semiconductor Announces Partnership with Samsung Foundry
DreamBig empowers customers to forge the future of AI, datacenter, edge, storage, and automotive solutions by developing application specific processor/accelerator chiplets and composing products by adding the chiplets to MARS Chiplet Platform with world leading Chiplet Hub for scale-up and Networking IO Chiplets for scale-out.
Littelfuse Completes Acquisition of the 200mm Wafer Fab Located in Dortmund, Germany
Acquisition supports long-term growth strategy by enhancing power semiconductor capabilities.
ASU Research Park Named as Planned Site for Third CHIPS for America R&D Flagship Facility
Facility is expected to host the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research facility.
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
NexWafe Hits Key Milestones in Solar Efficiency and Scalability
NexWafe GmbH (NexWafe) today announced significant breakthroughs in its solar wafer manufacturing technology.
