Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Study Finds Federal Incentives for Domestic Semiconductor Manufacturing Would Strengthen America’s Chip Production, Economy, National Security, Supply Chains

The Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), today released a study analyzing the impact of proposed federal incentives for domestic semiconductor manufacturing.

Lattice Extends Industry-Leading Security and System Control to Automotive Applications

Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced new versions of its MachXO3LF™ FPGAs for flexible deployment of robust automotive control applications and MachXO3D™ FPGAs for system security that support extended temperature operating ranges for automotive and other ruggedized applications.

Paragraf and NPL Demonstrate that Paragraf’s Graphene Hall Effect Sensors Are Ready for High-Radiation Applications in Space and Beyond

Paragraf, the leader in graphene-based transformative electronic sensors and devices, has demonstrated the ability of its graphene Hall Effect sensors to withstand high levels of radiation. The discovery, based on testing from the National Physical Laboratory (NPL), proves that ‘unpackaged’ Hall Effect sensors can be used in high-radiation environments such as space. The project was funded by Innovate UK, the UK’s innovation agency.

Electronics Division of Meridian Adhesive Group Enters Electric Vehicle Market

Meridian Adhesives Group, a leading manufacturer and custom formulator of high-value adhesives technologies, will now be serving the electric vehicle market with custom solutions by way of the company’s Electronics Division.

ACM Research Introduces Thin Wafer Cleaning System for High-volume Power Semiconductor Device Manufacturing

ACM Research, Inc., a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the introduction of its Thin Wafer Cleaning System, a high-throughput, four-chamber system designed for single-wafer wet processes, including cleaning, etching and surface finishing.

Microchip Partners with Machine-Learning (ML) Software Leaders to Simplify AI-at-the-Edge Design Using its 32-Bit Microcontrollers (MCUs)

Microchip Technology (Nasdaq: MCHP) today announced it has partnered with Cartesiam, Edge Impulse and Motion Gestures to simplify ML implementation at the edge using the company’s ARM Cortex based 32-bit micro-controllers and microprocessors in its MPLAB X Integrated Development Environment (IDE).

SOT-MRAM Pioneer Antaios Secures 11 Million Dollars in Funding

Antaios, a pioneer in SOT-MRAM technology (Spin-Orbit Torque Magnetic Random-Access Memory), announced today that it has secured 11 million dollars in funding to accelerate innovation and develop new strategic partnerships.

AMD CEO Dr. Lisa Su to Receive Semiconductor Industry’s Top Honor

The Semiconductor Industry Association (SIA) today announced Dr. Lisa Su, president and CEO of AMD and an accomplished leader in advancing semiconductor technology, has been named the 2020 recipient of SIA’s highest honor, the Robert N. Noyce Award.

Samsung Expands Advanced 0.7μm-Pixel ISOCELL Image Sensor Offerings for Wider Mobile Applications

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced four new Samsung ISOCELL image sensors for its 0.7 micrometer (μm)-pixel product lineup; 108-megapixel (Mp) ISOCELL HM2, 64Mp ISOCELL GW3, 48Mp ISOCELL GM5 and 32Mp ISOCELL JD1. With the new 0.7μm ISOCELL technology, Samsung plans to expand the ultra-high-resolution offerings to mainstream smartphones.

2020 IEEE International Electron Devices Meeting To Highlight Innovative Devices for a Better Future

The 66th annual IEEE International Electron Devices Meeting (IEDM), to be held virtually December 12-16, 2020, will uphold the conference’s tradition as the world’s premier forum for the presentation of applied research in transistors and related devices, which are the building blocks of modern electronics technology.