Today, Teledyne Aerospace & Defense Electronics UK (TADE UK) announced the latest business unit addition to its brand portfolio, Teledyne Energetics UK, headquartered in Lincoln, England.
ClassOne’s Solstice Plating System Selected for Advanced MicroLEDs
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice GoldPro electroplating system to one of the industry’s leading developers of microLED technology for advanced applications.
Imec Presents Low-Power 60 GHz Radar Chip for Contactless Health Tracking in Battery-Powered Devices
This week at the virtual conference IEEE RFIC, leading research and innovation hub imec presents a millimeter-wave motion detection radar at 60GHz, integrated in standard 28nm CMOS.
TDK Announces Ultra-High AOP Analog MEMS Microphone
The analog MEMS microphone is equipped with high dynamic range, operates up to 105°C, and is designed for IoT and consumer devices.
Strategic Materials Conference 2020 Goes Virtual to Highlight Materials on Cutting Edge of Technology Innovation
With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2020), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain.
Eta Compute Introduces TENSAI Flow, Enables Seamless Development of Machine Learning Applications in Low Power IoT Devices, from Concept to Firmware
Eta Compute Inc., a company dedicated to delivering machine learning to low power IoT and edge devices using its revolutionary TENSAI Platform, announced its TENSAI Flow software.
SiTime Enables 5G Vision of Zero Downtime with 10 Times Higher Reliability
SiTime Corporation, a market leader in MEMS timing, today announced the Cascade family of MEMS clock ICs for 5G, wireline telecom and datacenter infrastructure.
pSemi Expands Portfolio with Two High-Performance Digital Step Attenuators
pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with two new high-performance DSAs, PE43610 and PE43614.
Tachyum Shows Prodigy Running Existing x86, ARM, and RISC-V Software
Tachyum Inc. today announced that its Prodigy Universal Processor has successfully completed software emulation testing across x86, ARM and RISC-V binary environments.
Lam Research and VELO3D Strike Strategic Agreement to Use Metal Additive Manufacturing Applications for Production of Semiconductor Capital Equipment
Digital manufacturing innovator VELO3D and Lam Research Corporation(Nasdaq: LRCX) today announced a joint development agreement that includes collaboration on novel materials and designs in metal additive manufacturing (AM) or 3D printing applications for the semiconductor industry. Lam plans to significantly increase the volume of parts produced by AM over the next five years.
