The global capacitive sensor market was valued at US$ 28.6 Billion in 2019 and is expected to surpass US$ 41.3 Billion by 2027, registering a CAGR of 4.3% during the forecast period (2019-2027), as highlighted in a report published by Coherent Market Insights.
D2S Unleashes the Petaflops Computing Era for Semiconductor Manufacturing
D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today introduced the seventh generation of its computational design platform (CDP), a scalable processing solution for simulation-based semiconductor design and manufacturing applications.
Process Technology Unveils the SHX Family of Products
Process Technology, a leading manufacturer of inline, ultra-high purity heaters for the semiconductor industry, is excited to announce its new family of SHX and SHX-EX heaters for IPA and flammable solvents.
South Korean Point Engineering Chooses ClassOne’s Solstice S8 for Advanced Semiconductor Plating
ClassOne Technology, global supplier of high-performance semiconductor electroplating and surface preparation systems, announced the sale of its Solstice S8 system to South Korean chip manufacturer, Point Engineering Co.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes New Test Method for Continuous-Switching Evaluation of GaN Power Conversion Devices
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announces the publication of JEP182: Test Method for Continuous-Switching Evaluation of Gallium Nitride Power Conversion Devices.
Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex LogixÒ for demanding Artificial Intelligence (AI) applications such as object recognition.
STMicroelectronics Joins ZETA Alliance to Promote Emerging Long-Range IoT Connectivity Standard
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has joined the ZETA Alliance, the industry body promoting ZETA Low-Power Wide Area Network (LPWAN) technology for low-cost long-range IoT connectivity.
EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
EdgeQ Inc, a 5G systems-on-a-chip company, announced today that Dr. Paul Jacobs and Matt Grob have joined the advisory board.
CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications
CEA-Leti scientists, working with researchers at Politecnico di Milano, have developed the world’s first high-performance gyroscope for operating in severe environments, such as industrial and aeronautic equipment and automobiles.
Micron Delivers Industry’s First 1α DRAM Technology
Micron Technology today announced volume shipment of 1α (1-alpha) node DRAM products built using the world’s most advanced DRAM process technology and offering major improvements in bit density, power and performance.
