CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
SUEZ Unveils New Sievers TOC Analyzers for Online Ultrapure Water Monitoring
SUEZ – Water Technologies & Solutions announced the launch of two new Total Organic Carbon (TOC) online analyzers, the M500 for life sciences and the M500e for microelectronics markets.
CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
In an invited paper at IEDM 2020, CEA-List and CEA-Leti, research institutes at CEA, presented their technologies for achieving exascale-level, high- performance computing (HPC).
Combining Forces: LS Laser Systems and EPP Merge to Form L-TRIS
The Photonics Systems Group, a market leader in laser systems for micromaterial processing, is proud to announce the merger of two Group companies, LS Laser Systems and EPP Electronic Production Partners.
Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software
Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design automation (EDA) software in production and development use throughout the semiconductor industry.
Industry Strategy Symposium to Lead Microelectronics Into New Era of Innovation
SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds.
ClassOne Receives Repeat Order for its Solstice Electroplating System from Major Taiwanese Semiconductor Manufacturer
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice S8 electroplating system to a major semiconductor foundry service based in Taiwan.
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices
Two complementary research papers from CEA-Leti confirmed that the institute’s approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.
SiTime Continues Leadership in MEMS Timing Market with 2 Billion Units Shipped
SiTime Corporation today announced that it has cumulatively shipped 2 billion units of its silicon MEMS timing solutions.
SUSS MicroTec Opens New Production Facility in Taiwan
The new SUSS location in the state-funded Science Park in Hsinchu, Taiwan consists of an office and production area and an application, demonstration and training center. The expansion is a necessary step as part of the “SUSS 2025” corporate strategy, which envisages a significant increase in sales.
