Octonion SA, a deep tech software company specializing in Artificial Intelligence (AI) at the Edge for industrial-equipment diagnosis, announced an STM32Cube expansion package optimized for STM32L4+ microcontroller-based industrial-application development boards from STMicroelectronics.
Collaboration Helps Military Veterans Transition into NDT Careers
Olympus, a leading manufacturer of nondestructive testing (NDT) equipment, is supporting training school Warrior To Inspector’s mission to help transition retiring military veterans into a new NDT career by providing advanced inspection instruments for their ultrasonic testing (UT) courses.
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System
SkyWater Technology, the trusted technology realization partner, and Multibeam Corporation, the maskless lithography technology leader, today disclosed a partnership to deploy Multibeam’s Multicolumn Electron-Beam Lithography (MEBL) system into SkyWater’s newly expanded fabrication facility in support of SkyWater’s roadmap to advance its manufacturing capabilities and accelerate growth.
New Direction: Location and Motion Tracking Gets More Precise for Industrial Applications
PNI Sensor, a member of the SEMI-MSIG Positioning, Navigation and Timing (PNT) Technical Advisory Council, is developing advanced tracking systems that promise to increase industrial worker safety.
Xperi Licenses DBI to Canon for CMOS Image Sensors
Xperi Holding Corporation today announced Canon’s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors.
Jenoptik Offers Novel UFO Probe Card for PIC Wafer Level Testing
Jenoptik’s new UFO Probe technology targets the market for semiconductor equipment and processes for wafer-level testing in microelectronics.
Marvell Announces Industry’s First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
Marvell today unveiled the industry’s first 112G 5nm SerDes solution that has been validated in hardware.
EdgeQ Raises $51M in Funding to Unify 5G and AI in an Open and Programmable Platform to Ignite Edge Networks
EdgeQ Inc, a 5G systems-on-a-chip company, today announced its launch from stealth with $51 million in total funding, including $38.5 million in a Series A round.
CyberOptics to Present Technical Paper ‘Fast, 100% Wafer Bump Metrology and Inspection’ at Virtual IEEE PAINE Conference
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
GaN Systems Expands Power Market with GaN Power Module Evaluation Kits
GaN Systems announced the availability of four new integrated power module evaluation kits: 100V Driver GaN DC/DC Power Stage Module, 650V 150A Half-Bridge IPM, 650V 150A Full-Bridge Module and Driver, and 650V 300A 3-Phase Module and Driver.
