Kioxia Corporation today announced it will begin construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH.
An Artificial Cell on a Chip
Researchers at the University of Basel have developed a precisely controllable system for mimicking biochemical reaction cascades in cells.
Surrey Device Takes Us Closer to High-Performing Wearable and Eco-Disposable AI Electronics
The University of Surrey has unveiled a device with unique functionality that could signal the dawn of a new design philosophy for electronics, including next-generation wearables and eco-disposable sensors.
STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore in Partnership with A*STAR and ULVAC
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a world leader in Micro-Electromechanical Systems (MEMS) technology, announces a collaboration with A*STAR’s IME, a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore.
Dialog Semiconductor Partners with Alps Alpine for Automotive Haptic Applications
Dialog Semiconductor plc, a leading provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial IoT solutions, today announced automotive qualification for its DA7280 high-definition haptic driver.
OSRAM Selects Veeco’s Lumina MOCVD System for High-End LED Production and to Drive Next Generation Products
Veeco Instruments Inc. today announced that OSRAM Opto Semiconductors, a leading manufacturer of optoelectronic components, has qualified Veeco’s Lumina MOCVD System for production of high-end LEDs and to drive the next generation of advanced photonic devices.
Ansys Multiphysics Solutions Certified for Samsung Foundry’s Entire Line of FinFET Process Technologies
Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes.
Leading Edge Equipment Technologies Completes $7.6 Million Series A Financing to Commercialize Revolutionary Semiconductor Manufacturing Technology
Leading Edge Equipment Technologies, the maker of revolutionary silicon wafer manufacturing equipment for solar panels, announced today the closing of $7.6 million in Series A financing led by Prime Impact Fund.
Imec Begins Developing SARS-CoV-2 Test to Identify Positive Cases and Confirm Whether Someone Is Contagious In Less Than Five Minutes
Imec announced that it has started developing a groundbreaking SARS-CoV-2 test.
Deci Raises $9.1M in Seed Funding to Build AI that Crafts Next Generation of AI
Deci, the deep learning company dedicated to transforming the AI lifecycle, today announced it has raised $9.1 million in a seed round led by Israel-based VC firm Emerge and global VC fund Square Peg. The company is building an AI-based platform that can automatically craft robust, scalable, and efficient deep neural network solutions ready for production at scale. Deci aims to help AI practitioners build the next generation of deep learning models.
