Scientists from Harvard, ICFO, MIT, Raytheon BBN Technologies and NIMS construct the fastest and most sensitive graphene-based microwave bolometer achieved so far.
Colloidal Quantum Dot Light Emitters Go Broadband in the Infrared
Broadband light emission in the infrared has proven to be of paramount importance for a large range of applications that include food quality and product/process monitoring, recycling, environmental sensing and monitoring, multispectral imaging in automotive as well as safety and security.
IAR Systems Supports Ultra-Low-Power Renesas RE MCU Family in Industry-Leading Arm Tools
IAR Systems, the future-proof supplier of software tools and services for embedded development, announces the update of its leading development toolchain IAR Embedded Workbench for Arm. The update includes complete coverage for the ultra-low-power Renesas RE microcontroller (MCU) Family.
Busch Innovation in Vacuum Award Goes to Dilo
Dilo Armaturen und Anlagen GmbH has received the “Busch Innovation in Vacuum Award” from Busch Vacuum Solutions. The prize commends Dilo’s pioneering work in handling gases.
Pioneering Liquid Compression Molding Material from Henkel Advances Fan-In and Fan-Out Wafer-Level Packaging
Henkel Corporation today announced the commercial availability of LOCTITE ECCOBOND LCM 1000AF, a breakthrough encapsulation material that leverages a unique anhydride-free resin platform to enable thorough protection, improved warpage control and fine gap filling for fan-in and fan-out wafer-level packages (FI WLPs, FO WLPs).
Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications
Hprobe, a provider of semiconductor Automated Test Equipment (ATE) for magnetic devices, today announced the first industry turnkey testing equipment dedicated to 3D magnetic sensors used in both automotive and industrial applications.
Palomar Technologies New 8100 Wire Bonder Increases Productivity and Efficiency
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their new Palomar 8100 Wire Bonder.
AI Chipmaker Hailo Launches Top-Performing M.2 and Mini PCIe AI Acceleration Modules to Enhance Performance of Edge Devices
Hailo announced today the launch of its M.2 and Mini PCIe high-performance AI acceleration modules for empowering edge devices. Integrating the Hailo-8 processor, the modules can be plugged into a variety of edge devices, transforming multiple sectors with superior AI capabilities including smart cities, smart retail, industry 4.0, smart homes, and beyond.
STMicroelectronics Pioneers Smaller and Faster Chargers and Power Supplies with World’s First Driver and GaN Device
STMicroelectronics has unveiled MasterGaN®, the world-first platform embedding a half-bridge driver based on silicon technology along with a pair of gallium-nitride (GaN) transistors.
ULVAC Provides Total Service Solutions to U.S. and European-Based Vacuum Companies That Would Like to Expand in Japan and East Asia
ULVAC Technologies, Inc. (www.ulvac.com) has announced that their sister company, ULVAC TECHNO, Ltd. is offering U.S. and European-based vacuum companies a means of expanding their presence in Japan and East Asia (Korea, China, Taiwan).
