A nanoscale gold butterfly provides a more precise route for growing/synthesizing nanosized semiconductors that can be used in nano-lasers and other applications. Hokkaido University researchers have devised a unique approach for making nanosized semiconductors on a metal surface. The details of the method were reported in the journal Nano Letters and could further research into the fabrication of nanosized light and energy emitters.
MEMS-FHE Device Integration Gets Real
MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.
Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020
VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high.
Xperi Enters into New Patent and Technology License Agreement with SK hynix
Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world’s largest semiconductor manufacturers. The agreement includes access to Xperi’s broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.
Plessey Partners with Axus Technology to Deliver its Monolithic MicroLED Displays
Plessey, an embedded technologies developer at the forefront of microLED technology for the augmented reality (AR) and display markets, announces a partnership with Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
MEMS Market to Reach $28.4B by 2029
Micro-electromechanical systems offer significant benefits such as time-efficient, effective power consumption, and reduced weight as compared to traditional macro systems for mechanical and electrical functions. These benefits make MEMS-based devices more attractive for communication and connectivity applications.
STMicroelectronics Unveils Secure Cellular-Connectivity Offering for Industrial IoT and Automotive Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, in collaboration with trusted partners, has created a complete ecosystem for securely connecting Industrial IoT (IIoT) and automotive systems to cellular networks.
Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today that it has acquired the DELTA Microelectronics business unit of FORCE Technology, the European leader in ASIC supply chain services. With this acquisition, Presto adds ASIC design to its suite of services for the Industry 4.0, IoT, and autonomous driving market.
Hprobe, Leader in Magnetic Field Testing Announces Completion of a New Funding Round with International Investors
Hprobe, a provider of semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced the completion of a new funding round driven by international investors, providing an exceptional depth of expertise, a global ecosystem of partnerships and the endorsement of industry market leaders. The company has raised more than 2 million euros to support its strong international development in the field of spintronics based devices testing, such as MRAMs (Magnetic Random Access Memories) and TMR (Tunnel Magneto Resistance) sensors.
Dow Introduces First Solventless Silicone Conformal Coating with UV and Moisture Dual Cure
Dow (NYSE: Dow), introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing.
