Leti, a research institute of CEA-Tech, and Silvaco Inc. today announced, during the 56th Design Automation Conference (DAC) in Las Vegas, a project to estimate and model the yield of ultra-low-voltage (ULV), ultra-low-leakage (ULL) static random access memory (SRAM) used in computing applications.
Global Semiconductor Alliance Launches Initiative to Bolster Women’s Leadership
The Global Semiconductor Alliance unveiled its Women’s Leadership Initiative (WLI), seeking to significantly increase the number of women entering the semiconductor market, as well as elevating their participation as founders, leaders and board members.
CyberOptics to Launch New AVLS3 with CyberSpectrum Software and New NanoResolution MRS Sensor at SEMICON West
CyberOptics will exhibit at SEMICON West, July 9-11, 2019 in booth #5769 at the Moscone Center in San Francisco, CA.
Big Energy Savings For Tiny Machines
Inside all of us are trillions of tiny molecular nanomachines that perform a variety of tasks necessary to keep us alive. A team led by SFU physics professor David Sivak demonstrated for the first time a strategy for manipulating these machines to maximize efficiency and conserve energy.
Carnegie Mellon Researchers Create Soft, Flexible Materials With Enhanced Properties
A team of polymer chemists and engineers from Carnegie Mellon University have developed a new methodology that can be used to create a class of stretchable polymer composites with enhanced electrical and thermal properties.
Call For SEMICON WEST 2019 “Best Of West” Award Applications
The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form.
Mentor Certified for Latest TSMC 5nm FinFET Process and TSMC-SoIC 3D Chip Stacking Tech
Mentor, a Siemens business, announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified on TSMC’s 5nm FinFET process technology.
CEA-Leti Develops CMOS Process for High-Performance MicroLEDs That Could Overcome Display-Size Obstacles
Leti, a research institute of CEA Tech, recently announced a new technology for fabricating GaN microLED displays for applications ranging from smart watches to TVs with no size limit.
Semiconductor Leaders Strike Agreement on Global Policy Agenda
The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.
Silicon Reclaim Wafer Market Logs Second Year of Strong Growth but Softening Ahead
Logging a second consecutive year of strong growth, the silicon wafer reclaim market surged 19 percent to $603 million in 2018 on the strength of a record number of reclaimed wafers processed, SEMI, the industry association representing the global electronics manufacturing and design supply chain, reported in its 2018 Silicon Reclaim Wafer Characterization Summary.
