New drug measurement and monitoring technology for accurate assessment of drug concentrations in blood, paves the way for personalized and faster care.
Electronic Fluorocarbons is Now EFC Gases and Advanced Materials
After 20 years of successful operation as Electronic Fluorocarbons, the company has taken a significant step in their ongoing commitment to adapt, grow, and continue providing top-quality products and solutions.
Purdue Establishes Permanent Presence Next to NSWC Crane for Future of National Defense and Semiconductors
This investment will catalyze and accelerate the existing collaborative research agreements that focus on national security and defense and on semiconductors.
SEMI to License Server Certification Protocol to Help Combat Software Piracy
SEMI today announced that, starting in Q3 2023, it will license its server certification protocol to combat software piracy.
SEMICON Europa 2023 Conferences to Highlight Advanced Packaging and Fab Management as Key Enablers of Sustainability
Experts will gather for insights into the latest advanced packaging and fab management trends and innovations as critical enablers of the path to net zero at SEMICON Europa 2023, November 14-17 at Messe München in Munich.
Agile Analog Joins TSMC Open Innovation Platform IP Alliance Program
Agile Analog, the customizable analog IP company, has become a member of the TSMC IP Alliance Program, a key component of the TSMC Open Innovation Platform (OIP).
MRSI Introduces 705HF High Force Die Bonder for Power Devices and Advanced Chip Packaging
MRSI Systems, a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform.
Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award
Dr. Lawrence Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, will be honored with the 2023 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD).
Chiplets Reduce Development Time and Cost
Chiplet Summit announces its second annual event on February 6-8 at the Santa Clara Convention Center.
ROHM’s New EcoGaN Power Stage ICs Contribute to Smaller Size and Lower Loss
ROHM Semiconductor today announced the BM3G0xxMUV-LB series of power stage ICs with built-in 650V GaN HEMTs and gate drivers.
