Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.
As Intel expands its domestic manufacturing operations, they will conduct new semiconductor research in advanced semiconductor technology working with IBM’s Albany Semiconductor Research Facility.
Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Company (TSMC), provided detailed insights into the company’s technology roadmap at the recent International Solid-State Circuits Conference (ISSCC). He waved off the suggestion that device technology improvements are slowing down.
The shortage of semiconductors won’t be easy to solve, with some equipment lead times stretching out several years, said VLSI Research CEO Dan Hutcheson at a SEMI event.
Intel’s new CEO Pat Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories fabs in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.
I have some sad news to share. Industry pioneer and legend Aubrey “Bill” Tobey passed away on March 1st. He was a good friend and a great supporter of The ConFab event that we produced.
Once the pandemic has passed, which changes in ordinary life are likely to endure? And how do memory IC manufacturers ensure that they are ready to meet the changed requirements of electronics device OEMs?
CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques.
Cast Aluminum Solutions (CAS) – a leading supplier of precision-engineered thermal components used in semiconductor wafer processing applications – announced the launch of its new CAST-X High Temperature Heater line.
Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.