The simple addition of conveyors to existing OHT systems achieves the shorter cycle times due to tighter coupling of tools.
The role of cryogenic wafer probing in applications such as cryogenic quantum computing and supra-conductive CMOS semiconductors, where temperatures near absolute zero are essential, is discussed.
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
Embracing and integrating new component-level technologies is a way to measurably improve quality, safety and yield.
The U.S. Department of Commerce announced the appointment of 24 members to the Industrial Advisory Committee (IAC).
How much value could a smooth, coherent flow of data across the fab and wider enterprise give to the business?
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has signed a cooperative research and development agreement with Google to develop and produce chips that researchers can use to develop new nanotechnology and semiconductor devices.
An open, secure monitoring and intelligence transaction platform would empower chip manufacturers to solve their problems and optimize their operations, their way.