Pete Singer

Co-Founder / Editor-in-Chief

233 Articles1 Comments

Pete has over 39 years of publishing experience. He co-founded Semiconductor Digest and the Gold Flag Media company with publisher Kerry Hoffman in 2019. Previously, he spent over 25 years at Semiconductor International and 11 years at Solid State Technology.

ZVEI Robustness Validation Process for Assessing Semiconductor IC Mission Profiles

The need to change reliability assessment methods of semiconductor ICs in extended power-on automotive applications

Maximizing Protection of Flip Chip Interconnects

NCP and NCF property and process optimization deliver high-reliability results.

Video Compression on Display Interfaces Enables Next-Generation Display Applications

There are proven, visually lossless video compression technologies to consider when designing systems that will support future displays. Two of these, VESA DSC and VDC-M, are integrated with MIPI DSI-2, the most widely adopted embedded display interface used in mobile, AR/VR, automotive and other industries.

Support for Trusted Chip Manufacturing Needed to Counter CCP

Legislation being considered in Washington “gives our citizens the tools and means to out-innovate, out-compete, and outgrow the Chinese Communist Party.” — Sen. Todd Young, (R-Ind.),

Edge AI Computing Advancements Driving Autonomous Vehicle Potential

Autonomous driving systems are extremely complex; they tightly integrate many technologies, including sensing, localization, perception, decision making, as well as the smooth interactions with cloud platforms for high-definition (HD) map generation and data storage.

3 Ways Wide-Bandgap Semiconductors Improve Electric Vehicle Performance

Engineers continually look for feasible ways to improve electric vehicles (EVs) as they become more in-demand. One increasingly frequent approach is to use wide-bandgap semiconductors in their design. Here are some compelling examples of how these components improve EV performance.

Panel-Level Heterogeneous Integration Technology for Analog ICs

Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.

Time-Resolved, In-Line Airborne Particle Sensing

IPS and wireless wafer/reticle format counters can detect particulate contamination events exactly when and where they occur, with results available in real-time, or stored for later analysis.

How Can a Digital Twin Help Semiconductor Systems Design?

A digital twin is a virtual, extremely detailed version of a physical asset. People create them as single components and all the way up to entire factories. Doing so can let them see the impact of certain decisions before moving ahead with them in real life.

Emerging Vacuum Challenges Posed by New Materials and Cluster Tool Architectures

New processes and materials pose many challenges for supporting vacuum equipment. Intelligent design choices can address these challenges.