Managing semiconductor manufacturing intricacy requires more than traditional analytics; it demands advanced, data-driven insights to stay competitive.
AI
NEOM Investment Fund Partners with MemryX to Scale Energy-Efficient Edge AI Computing
NEOM Investment Fund (NIF), the investment arm of NEOM, has announced a strategic investment in MemryX, a US-based leader in Edge AI semiconductor solutions.
Alpha and Omega Semiconductor Enables 48V Hot Swap in AI Servers with New High SOA MOSFET
Alpha and Omega Semiconductor Limited today announced its AOTL66935 utilizes AOS’ 100V AlphaSGT proprietary MOSFET technology.
xMEMS Extends µCooling Fan-on-a-Chip Technology to AI Data Centers
xMEMS Labs, Inc. today announced the expansion of its revolutionary µCooling fan-on-a-chip platform into AI data centers, bringing the industry’s first in-module active thermal management solution to high-performance optical transceivers.
Aidentyx Unveils Chip Industry’s First Manufacturing AI Framework
The path to continuous improvement for semiconductor manufacturers got a lot easier today with the announcement by Aidentyx, Inc. that it has rolled out the chip industry’s first Manufacturing AI framework featuring multiple applications, each backed by specialized AI engineering agents orchestrating smart, secure, and net-zero-friendly AI analytics that promote greater interoperability, collaboration, and increased performance among applications and data sources.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
VSORA Raises $46 Million to Bring World’s Most Powerful AI Inference Chip to Market
VSORA, a French innovator and the only European provider of ultra-high-performance artificial intelligence (AI) inference chips, today announced that it has successfully raised $46 million in a new fundraising round.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ChEmpower Secures $18.7M to Advance Abrasive-Free Planarization in Chip Manufacturing
New investment to drive sustainability in advanced AI chip manufacturing.
Microchip Unveils New High-Density Power Module for AI at the Edge Applications
AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications.
