Year-to-year market growth in February is largest since May 2022; worldwide chip sales decrease 3.1% month-to-month.
AI
Lambda Announces $500M GPU-Backed Facility to Expand Cloud for AI
Lambda, the GPU cloud company founded by AI engineers and powered by NVIDIA GPUs, today announced that it has secured a special purpose GPU financing vehicle of up to $500 million to fund the expansion of its on-demand cloud offering.
SiMa.ai Secures Funds and Readies New Generative Edge AI Platform
SiMa.ai, the software-centric, embedded edge machine learning system-on-chip company, today announced it has raised an additional $70M of funding led by Maverick Capital, with participation from Point72 and Jericho, as well as existing investors Amplify Partners, Dell Technologies Capital, Lip-Bu Tan and others.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Aspinity Establishes Technical Advisory Board
Aspinity today announced the formation of its technical advisory board, including Kymeta President and CEO Rick Bergman and Boston Consulting Group (BCG) Advisor Bill Earnshaw.
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
NY CREATES and C2MI Announce Partnership
NY CREATES and MiQro Innovation Collaborative Centre – C2MI today announced a partnership between the two entities that will enhance research opportunities, expand potential for economic and workforce development, and nurture collaborative efforts.
Hailo Closes New $120 Million Funding Round and Debuts Hailo-10
Hailo’s funding now exceeds $340 million as the company introduces its newest AI accelerator specifically designed to process LLMs at low power consumption for the personal computer and automotive industries, bringing generative AI to the edge.
DGIST Develops Next-Gen AI Semiconductor Devices Resembling the Human Brain
DGIST (President Kunwoo Lee) announced on Thursday February 29th that a team led by Prof. Kwon Hyuk-jun of the Department of Electrical Engineering and Computer Science has developed a next-generation AI semiconductor technology that mimics the human brain’s efficiency in AI and neuromorphic systems.
Celestial AI Announces Photonic Fabric Adoption by Lead Hyperscaler Customers
Celestial AI, an innovator in AI technology, is pleased to present the Photonic Fabric, a pioneering optical compute and memory fabric solution for supercharging AI infrastructure at OFC 2024.
