AI

Advent of 5G and AI Chip Manufacturing Renews the Need for Advanced Semiconductor Testing Systems

A surge in semiconductor test volumes and stringent test demands from the communication, consumer electronics, automotive and healthcare verticals are expected to revive the semiconductor industry following a sharp decline in revenues for the global semiconductor automated test equipment market in 2019.

Transistor Count Trends Continue to Track with Moore’s Law

Though growth rates in some product categories have slowed, doubling of transistors per chip every two years remains a guideline that the industry continues to follow.

A Flexible Brain for AI

Researchers at Osaka Univ. fabricate an energy efficient reconfigurable computing engine that can be rewired to optimize its performance for artificial intelligence tasks. This work may lead to inexpensive and eco-friendly custom machine learning hardware.

IKBFU Physicists Keep Improving ‘Smart’ Composites for Biomedical Sensors

IKBFU Physicists have successfully tested the new magnetic micro wire-based concept of “smart” composites production. The new composites are related to the multiferroic-class materials which have mutually controlled magnetic and electric properties. The effects observed in the compositions are considered to be a perspective platform for creating new devices from energy converters to highly sensitive sensors.

AI Chipmaker Hailo Raises $60 Million in Series B Funding

Hailo, the leading AI chipmaker delivering unprecedented performance to edge devices, today announced it has raised $60 million in Series B funding. The round, led by existing investors, was joined by key strategic investors including ABB Technology Ventures (ATV) – the strategic VC arm of ABB, a global leader in industrial automation and robotics; NEC Corporation – a leader in the integration of IT and network technologies; and London-based VC firm Latitude Ventures.

SEMICON Southeast Asia 2020 Postponed to August 2020

SEMI announced today that it is postponing SEMICON Southeast Asia 2020, the region’s premier event for…

BISTel Announces First Cloud Capable, A.I. Powered FDC System for Semiconductor Manufacturing

BISTel, the leading supplier of engineering automation and manufacturing A.I. applications announced today the semiconductor industry’s first cloud capable, A.I. powered, fault detection and classification system (FDC). The new FDC solution, called Dynamic Fault Detection (DFD) in the cloud, offers chipmakers a more comprehensive method for detecting faults.

Global Semiconductor Sales Down Slightly Year-to-Year in January

“The global semiconductor market got off to a solid start in 2020, with the industry nearly posting positive year-to-year sales growth for the first time in more than a year,” said John Neuffer, SIA president and CEO. “Still, the global market faces significant macroeconomic headwinds, including global trade unrest and ongoing concerns about worldwide spread of the coronavirus, which could limit continued market recovery.”

Cartesiam AI Development Environment Brings Artificial Intelligence, Learning and Inference to Everyday Objects

Cartesiam, a company that creates artificial intelligence (AI) software for embedded systems, today announced at the Embedded World conference the availability of NanoEdge™ AI Studio, the first integrated development environment (IDE) that enables machine learning and inference directly on Arm Cortex-M microcontrollers (MCUs).

GlobalSign and Infineon Combine Forces to Strengthen IoT Device Identity

GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.

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