Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
Design
Siemens and Intel Foundry Advance Collaboration
Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement.
Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
At today’s Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry’s first commercial foundry implementation of PowerVia backside power delivery.
HKUST Research Sheds Light on Future Applications in Spintronics and Valleytronics
A team led by Prof. LIU Junwei from the Department of Physics at the Hong Kong University of Science and Technology (HKUST), along with their experimental collaborators, published their latest research findings in Nature Physics, which unveiled the first experimental observation of a two-dimensional layered room-temperature altermagnet, validating the theoretical predictions in Nature Communications made by Prof. Liu in 2021.
DNA-Inspired Design for Stronger, Flexible Sensors for Wearables
The double-helical design places both electrodes at one end, preventing damage that typically occurs when electrodes are pulled at joints.
Researchers Develop a Novel Annealing Processing System
In a groundbreaking study, a research team from Japan, led by Professor Takayuki Kawahara from the Department of Electrical Engineering at Tokyo University of Science, Japan, developed an innovative dual scalable annealing processing system (DSAPS) that can simultaneously scale both capacity and precision using the same scalable structure.
ASIC and SoC Design Partner Rebrands as Aion Silicon
Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team.
Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance
Aion Silicon (formerly Sondrel) today announced it has joined the Intel Foundry Accelerator Design Services Alliance.
ChEmpower Secures $18.7M to Advance Abrasive-Free Planarization in Chip Manufacturing
New investment to drive sustainability in advanced AI chip manufacturing.
Siemens Collaborates with TSMC to Drive Further Innovation in Semiconductor Design and Integration
Siemens Digital Industries Software today announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
