Design

Toshiba and Global Power Technology Accelerate Their Patent Filings on SiC Power Devices

According to data from our SiC Patent Monitor, power silicon carbide (SiC) technology saw robust patenting activity in Q1 2025, with over 840 new patent families filed globally.

Circuits Integrated Hellas Launches Game-Changing Kythrion Satcom Chipset

Circuits Integrated Hellas (CIH), an innovator in advanced satellite communication (Satcom) technology, today launched Kythrion, its chipset platform engineered to transform the satellite communications (Satcom) landscape.

SEMI North America Advisory Board Welcomes New Member From SACHEM, Inc.

SEMI today announced the election of a new member to the SEMI North America Advisory Board (NAAB), Rosemary Steen Hoffman, Chief Executive Officer, SACHEM, Inc., a supplier of high-purity, precision-based chemistries.

MIRA XR: New Ultra-High-Resolution SEM-EDS Solution by TESCAN GROUP

TESCAN GROUP introduces the MIRA XR, an ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis in academic research and quality control environments.

Curvilinear Technology: A Game Changer for the Logic Technology Roadmap

Imec enables the ‘curvilinear’ manufacturing ecosystem – from design over OPC and mask to wafer.

CHIPS Act and R&D – Who Will Pay for Leading Edge?

An increased investment in R&D is required, as well as a strategic rethinking of how existing manufacturing infrastructure can be modernized to meet future demands.

Asahi Kasei Microdevices Launches New Series of Power Management ICs for Energy Harvesting

Asahi Kasei Microdevices (AKM) has developed the AP4413, a new series of ultra-low current power management ICs (PMICs) ideal for battery charging systems used in energy harvesting1applications.

Expanding Access to Advanced Chip Design Capabilities: Launch of the EU Chips Design Platform

A consortium of 12 European partners has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.

Unique Molecule May Lead to Smaller, More Efficient Computers

A team of physicists from the University of Miami, with two collaborators, developed a new type of molecule that could offer a groundbreaking material for computer chips.

ETEI Electronics Establishes Warehouse and Shipping Inspection Center in Hong Kong

ETEI Electronics Co., Ltd. announced the opening of its new warehouse and shipping inspection center in Hong Kong.

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