Implementing practices inspired by Agile way or working into chip design processes offers substantial benefits in enhancing compliance and reliability.
Design
How LTE-M Outperforms Other Technologies in Asset Tracking
The choice of connectivity technology plays a decisive role in the success of tracking assets anywhere in the world.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
Modeling Techniques to Speed up Simulation and Emulation in Complex Mixed Signal Devices
A new technique yielded a much better filter response, where the current to charge information was well preserved and also reduced filter complexity. This solution leads to less computations and events for the simulator to process, in turn speeding up the simulation.
Foundries in Europe 2024
Europe will be ready to grow again its market share but should maintain the current status quo and still source about 50% of production abroad.
TANAKA Develops AgSn TLP Sheet, A Bonding Material for Power Semiconductors
Compatible with large chip sizes of 20mm, enabling highly reliable bonding over extensive areas and contributes to growing demand for high-current power semiconductors in electric vehicles, hybrid automobiles, industrial infrastructure, etc.
Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
Series B funding led by Maverick Silicon fuels market expansion and ability to meet rapidly growing demand for hyper-efficient data movement in agile complex silicon systems.
Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit
Numem will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance.
New Optical Memory Unit Poised to Improve Processing Speed and Efficiency
Fast, versatile volatile photonic memory could enhance AI, sensing and other computationally intense applications.
MACOM Signs Preliminary Memorandum of Terms for Federal CHIPS and Science Act Funding
Today, the Healey-Driscoll administration celebrated MACOM Technology Solutions Inc. (MACOM), the Lowell-based manufacturer that develops and supplies semiconductor components to the commercial and defense sectors, signing a preliminary memorandum of terms with the federal government for funding under the CHIPS for America program.
