Design

Park Systems Announces Park FX40, the Autonomous AFM with Built-in Intelligence

Park Systems, the fastest growing manufacturer of Atomic Force Microscopes (AFM) just announced Park FX40, a groundbreaking autonomous atomic force microscope, infused with innovative robotics, intelligent learning features, safety features, software and specialized add-ons.

Supplyframe Announces the Launch of DesignSense Sales Intelligence

Many people today shop for and research potential purchases online. Semiconductor and electronic component buyers are no exception.

How Chip Technology Will Decipher Brain Diseases

As part of Mission Lucidity, the brain-on-chip project tackles Parkinson’s disease. Central in this endeavor is imec’s high-density multi-electrode array (MEA) that can interface at a single-cell level. With stem cell technology that can reprogram cells, the MEA can create and tweak any relevant brain circuit to study disease mechanisms and the effects of drugs on the circuits.

Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame

Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.

Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors

Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.

SmartDV Announces Support for ARINC Standards with Design and Verification IP

SmartDV Technologies today announced support of the ARINC standards with its Design and Verification IP.

Intel 144-Tier Three-deck FG NAND with 161 Total Gates

A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.

Murata Launches New Chip Ferrite Beads for Automotive Applications

Murata has introduced the BLM18KN_EH series of chip ferrite beads for noise suppression in power lines at temperatures up to 175°C.

AI Chipmaker Hailo Awarded Edge AI and Vision Product of the Year

The Hailo-8, the AI processor for edge devices from AI (Artificial Intelligence) chipmaker Hailo, has been selected as winner of the 2021 Edge AI and Vision Product of the Year Awards for “Best Edge AI processor.”

Winbond and Ambiq Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables

Winbond Electronics Corporation and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.

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