“The global semiconductor market got off to a solid start in 2020, with the industry nearly posting positive year-to-year sales growth for the first time in more than a year,” said John Neuffer, SIA president and CEO. “Still, the global market faces significant macroeconomic headwinds, including global trade unrest and ongoing concerns about worldwide spread of the coronavirus, which could limit continued market recovery.”
Design
Graphene, Perovskites, and Silicon — An Ideal Tandem for Efficient Solar Cells
Graphene Flagship researchers at the University of Rome Tor Vergata, the Italian Institute of Technology (IIT) and its spin-off, Graphene Flagship Associate Member BeDimensional, in cooperation with ENEA have successfully combined graphene with tandem perovskite-silicon solar cells to achieve efficiencies of up to 26.3%. Moreover, they envisioned a new manufacturing method that, thanks to the versatility of graphene, allows to reduce production costs and could lead to the production of large-area solar panels. Graphene-based tandem solar cells almost double the efficiency of pure silicon.
Sensera Signs World-Wide Distribution Agreement with Braemac to Extend Global Reach
Sensera Limited (ASX: SE1, “Sensera”), an Internet of Things (IoT) solution provider, today announced that it has signed a worldwide distribution agreement with Braemac. Braemac’s global footprint and strong presence in the entire Pacific Rim region and especially Australia will further extend Sensera’s market coverage.
Scientists Succeed in Measuring Electron Spin Qubit Without Demolishing It
A group of scientists from the RIKEN Center for Emergent Matter Science in Japan have succeeded in taking repeated measurements of the spin of an electron in a silicon quantum dot (QD), without changing the spin in the process. This type of “non-demolition” measurement is important for creating quantum computers that are fault tolerant.
SEMI-FlexTech Announces 2020 FLEXI Awards Winners for Outstanding Achievements in Flexible Hybrid Electronics
Recognizing innovations and other outstanding accomplishments in Flexible Hybrid Electronics (FHE), SEMI-FlexTech, a SEMI Strategic Association Partner, yesterday presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, California. The FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Technology & Education in Leadership, Technology Champion and Industry Leadership.
Cartesiam AI Development Environment Brings Artificial Intelligence, Learning and Inference to Everyday Objects
Cartesiam, a company that creates artificial intelligence (AI) software for embedded systems, today announced at the Embedded World conference the availability of NanoEdge™ AI Studio, the first integrated development environment (IDE) that enables machine learning and inference directly on Arm Cortex-M microcontrollers (MCUs).
GlobalSign and Infineon Combine Forces to Strengthen IoT Device Identity
GMO GlobalSign (www.globalsign.com), a global Certificate Authority (CA) and leading provider of identity and security solutions for the Internet of Things (IoT), and semiconductor manufacturer Infineon Technologies AG, today announced a solution that secures, simplifies, and streamlines device enrollment into Microsoft Azure IoT Hub and IoT Hub Device Provisioning Service. The collaboration eases complex device identity integration challenges and delivers a proven path for IoT device security literally from chip to cloud.
IAR Systems Extends Arm Tools Offering With Support for Renesas Electronics’ RA Family
Today, IAR Systems® announces full coverage for the RA Arm® Cortex® microcontrollers (MCUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugging features in an easy-to-use integrated development environment with excellent worldwide technical support and training.
David K. Lam to Unveil “Security Lithography” Advances to Thwart IC Counterfeiting at SPIE
Silicon Valley Hall of Famer and Founder of Lam Research to present unsurpassed levels of on-chip security enabled by Multicolumn E-beam Lithography (MEBL)
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
