Design

JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance

JEDEC Solid State Technology Association today announced the publication of JESD209-6, the latest Low Power Double Data Rate 6 (LPDDR6) standard.

SK hynix Adopts Infinitesima 3D Metrology Tool for Volume DRAM Production

Infinitesima today announced that SK hynix, a full stack artificial intelligence (AI) memory provider, has adopted the Metron3D 300mm in-line wafer metrology system and released it for use in volume production.

POET Technologies Announces Appointment of Sohail Khan as Director

Mr. Khan’s appointment was effective as of Monday, July 7, 2025 and, along with the incumbent five directors of the Company, he will serve until the next annual meeting of shareholders of the Company or until his successor is duly elected or appointed.

Microchip Partners with Nippon Chemi-Con and NetVision

An automotive industry transition is underway to replace proprietary camera connectivity with solutions based on the open and interoperable Automotive Serdes Alliance Motion Link (ASA-ML) standard driven by over 150 member companies worldwide.

DVCon Europe Announces Keynotes for 2025

The Design and Verification Conference & Exhibition Europe (DVCon Europe), sponsored by Accellera Systems Initiative, has announced its keynote speakers for this year’s event on October 14th and 15th at the Holiday Inn Munich.

Renesas Strengthens Power Leadership with New GaN FETs

Renesas Electronics Corporation today introduced three new high-voltage 650V GaN FETs for AI data centers and server power supply systems including the new 800V HVDC architecture, E-mobility charging, UPS battery backup devices, battery energy storage and solar inverters.

3D Printing Breakthrough Paves Way for Next-Gen Medical Devices and Stretchable Electronics

Researchers at The University of Texas at Austin have developed a fast, precise new 3D printing method that seamlessly merges soft and hard properties into a single object using different colors of light. 

IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies

Researchers reveal that advanced nanolaser designs enable ultra-low power operation and compact integration for next-generation optical systems.

POET Signs Manufacturing Agreement with NationGate Solutions in Malaysia

POET Technologies Inc. today announced that it has signed a Master Agreement, Module Purchase Agreement and a Deed of Consignment with NationGate Solutions (M) Sdn. Bhd, to manufacture optical engine assemblies for POET in Penang, Malaysia.

Arteris Addresses Silicon Design Reuse Challenge with Magillem Packaging

Arteris, Inc. today announced the immediate availability of Magillem Packaging, a new software product designed to simplify and speed up the process of building advanced chips used in everything from AI data centers to edge devices.

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