Design

Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024

Synopsys, Inc. today announced that its Board of Directors has appointed Sassine Ghazi as president and Chief Executive Officer effective on Jan. 1, 2024.

Tachyum Achieves 192-Core Chip After Switch to New EDA Tools

Tachyum today announced that new EDA tools, utilized during the physical design phase of the Prodigy Universal Processor, have allowed the company to achieve significantly better results with chip specifications than previously anticipated, after the successful change in physical design tools – including an increase in the number of Prodigy cores to 192.

Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale

Kneron, the San Diego-based full stack AI company known for pioneering neural processing units (NPUs), is today announcing the launch of KL730, an auto-grade NPU chip with an integrated Image Signal Processor (ISP), bringing secure, low-energy AI capabilities to a wide range of applications, from enterprise-edge servers to smart home appliances and advanced driving assistance systems. 

The Road to the Future of Li-rich Solid-State Battery

High-capacity Li-rich oxide materials have gained attention for their unique anion-cation charge compensation. Yet, high operating voltage, cycling issues, unsafe oxygen evolution, and voltage decay hinder industrial use.

Artificial Intelligence Designs Advanced Materials

Artificial intelligence (AI) is playing an increasingly pivotal role in designing new alloys.

CEVA Joins Samsung SAFE Foundry Program

CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today announced that it has joined the Samsung Advanced Foundry Ecosystem (SAFE) to streamline chip design and accelerate time-to-market for CEVA licensees using Samsung’s advanced foundry processes.

One Year After Enactment, CHIPS & Science Act is on Path to Success; Work Remains to Maximize Impact

Semiconductor Industry Association (SIA) President and CEO John Neuffer today released the following statement regarding the one-year anniversary of enactment of the CHIPS and Science Act, a landmark law that provides $52 billion for semiconductor manufacturing incentives and research initiatives.

Simple Ballpoint Pen Can Write Custom LEDs

Researchers have developed ink pens that allow individuals to handwrite flexible, stretchable optoelectronic devices on everyday materials including paper, textiles, rubber, plastics and 3D objects.

TSMC to Build Multi-Billion-Euro Chip Factory in Germany

Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.

Governor Hochul Announces the Establishment of World-Class AMD Design Centers in New York State

High-performance semiconductor design company commits to creating 165 new jobs in two New York State locations.

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