Design

SEMICON West 2023 Opens Tomorrow to Showcase Industry Growth to $1 Trillion, Sustainability and Talent

Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations.

What’s in the July Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up your copy in print at SEMICON West in the publication bins and at the Semiconductor Digest Booth 1829.

3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West

Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.

Redox-Based Transistor as a Reservoir System for Neuromorphic Computing

With major breakthroughs in artificial intelligence, image recognition, and object detection, the field of computing has witnessed a remarkable revolution in recent times.

Ansys Power Integrity Signoff Solutions Certified for Samsung’s 2nm Silicon Process Technology

Following close collaboration with Samsung Foundry, Ansys has achieved certification of Ansys RedHawk-SC and Ansys Totem power integrity signoff solutions for Samsung’s latest 2nm silicon process technology.

Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development

Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships.

Airbus and STMicroelectronics Collaborate on Power Electronics for Aircraft Electrification

Airbus and STMicroelectronics have signed an agreement to cooperate on power electronics Research & Development to support more efficient and lighter power electronics, essential for future hybrid-powered aircraft and full-electric urban air vehicles.

OMNIVISION Adds Two New Products to Its Broad Family of Global Shutter Sensors

OMNIVISION today announced two new additions to its Nyxel near-infrared (NIR) technology family.

Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing

Intel makes new quantum chip available to university and federal research labs to grow the quantum computing research community.

Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio

Cadence Design Systems, Inc. today announced ​​that it has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications.

Featured Products