The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.6%.
Design
ASMC 2023 Opens With Advanced Semiconductor Manufacturing Excellence in Focus
More than 85 experts will offer insights on the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 34th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023), opening today in Saratoga Springs, New York.
MIT Engineers “Grow” Atomically Thin Transistors On Top of Computer Chips
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
Student Competition Prepares Participants for Semiconductor Cybersecurity Workforce
Yesterday, competitors, organizers, and sponsors gathered in person for the first time in three years to celebrate the completion of MITRE’s 2023 Embedded Capture the Flag (eCTF) Competition.
U.S. CHIPS Program Office Awards TECHCET with Sole Source Contract for Critical Materials Supply Chain Info
TECHCET announced it has been awarded a contract from the National Institute of Standards and Technology (NIST)/ CHIPS Program Office (CPO) for materials supply chain data and analysis.
Semtech and Connected Development Launch New LoRa-Based IoT Development Board and Reference Design
Semtech Corporation and Connected Development, today announced the launch of the new XCVR Development Board and Reference Design integrating the LoRa Sub-GHz Radio Transceiver.
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
Cadence Design Systems, Inc. today announced that the Cadence 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
onsemi and ZEEKR Sign Long-Term Supply Agreement for Silicon Carbide Power Devices
ZEEKR and onsemi announce long-term supply agreement for EliteSiC power devices.
POLYNICES Project Launched in Europe
Polymer-based components enable low-cost photonic modules for THz sensing and quantum computing applications.
