The MES & Industry 4.0 International Summit, to be held on September 7 – 8, 2023 at Alfândega Congress Centre in Porto, is aimed to help manufacturers ‘Connect for a Smarter Future’.
Design
U.S. Secretary of Commerce Gina Raimondo Announces Fiber Manufacturing Expansions in North Carolina
Today, as part of the Biden-Harris Administration’s Investing in America tour, U.S. Secretary of Commerce Gina Raimondo and Assistant Secretary of Commerce for Communications and Information Alan Davidson traveled to Hickory, NC to celebrate the announcement of new fiber optic cable production in the U.S. made possible by the Administration’s Internet for All Initiative.
New Chip Design to Provide Greatest Precision in Memory to Date
A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
New Resources for CHIPS Applicants
Today, the Department of Commerce is releasing pre-application and application instructions, guidebooks, and other resources for the first CHIPS for America funding opportunity for leading-edge, current-generation, mature-node, and back-end semiconductor fabrication facilities.
Scientists Integrate Two-Dimensional Materials Into Silicon Microchips for Advanced Data Storage and Computation
A team of scientists at King Abdullah University of Science and Technology (KAUST) led by Dr. Mario Lanza, associate professor of materials science and engineering, has successfully integrated two-dimensional materials on silicon microchips, and achieved excellent integration density, electronic performance and yield.
Gordon Moore, Intel Co-Founder, Dies at 94
Intel and the Gordon and Betty Moore Foundation announced that company co-founder Gordon Moore died on March 24, 2023, at the age of 94.
Ruggedness of Cambridge GaN Devices’ ICeGaN Technology Proven in Virginia Tech Paper at APEC
70 V over-voltage capability combines with intelligent on-chip protection to deliver highest GaN reliability and ruggedness.
FUJIFILM Electronic Materials, U.S.A., Inc. Invests in Enhanced Sustainability for its Mesa, Ariz. Campus
FUJIFILM Electronic Materials, U.S.A., Inc., announced today key sustainability initiatives designed to increase the organization’s commitment to sustainable business practices, including solar panel installation and water conservation measures.
NVIDIA Redefines Workstations to Power New Era of AI, Design, Industrial Metaverse
NVIDIA today announced six new NVIDIA RTX Ada Lovelace architecture GPUs for laptops and desktops, which enable creators, engineers and data scientists to meet the demands of the new era of AI, design and the metaverse.
Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
The 2023 decline will stem from weakening chip demand and higher inventory of consumer and mobile devices.
