Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO), which address fundamental challenges facing data centers about how to deal with the rapidly increasing amount of data as AI evolves.
Design
TXOne Networks Introduces Breakthrough Capability for Intelligent Vulnerability Mitigation in New Release of TXOne SageOne
TXOne Networks today announced an expanded new version of its SageOne OT Cybersecurity Governance Platform.
Micron Ships World’s First 1γ (1-Gamma)-Based LPDDR5X
Micron Technology, Inc. (Nasdaq: MU), announced today that it is shipping qualification samples of the world’s first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory, designed to accelerate AI applications on flagship smartphones.
Optimizing Tester Memory Resources with Xtreme Pooling Technology
Xtreme Pooling extends vector-memory capacity up to 896 GV per pin by dynamically redistributing unused memory across test processors.
From Invention to AI Acceleration: Celebrating 40 Years of FPGA Innovation
This year marks the 40th anniversary of the first commercially available field-programmable gate array (FPGA), introducing the idea of reprogrammable hardware.
Exploiting the Full Potential of Multiferroic Materials for Magnetic Memory Devices
Researchers demonstrate a new strategy for magnetization reversal in multiferroic materials, opening pathways to more energy-efficient electronics.
A New Model to Accurately Develop Better OLEDs
Researchers develop a new analytical model detailing the kinetics of the exciton dynamics in TADF materials, the primary component in OLEDs.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
Siemens Digital Industries Software announced today the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
Can AI Make Critical Communications Chips Easier to Design?
Radio frequency integrated circuits (RFIC) are critical to advancing communications capabilities—think moving from 5G networks to 6G—and many other technological applications. But these chips are also really hard to design.
Northeast Microelectronics Coalition Launches Third PROPEL Funding Opportunity to Advance Microelectronics Commercialization
The Northeast Microelectronics Coalition (NEMC) today announced the launch of its third Powering Regional Opportunities for Prototyping Microelectronics (PROPEL) funding initiative.
