A research team at the University of Turku, Finland, has developed an innovative approach to replicating bioinspired microstructures found in plant leaf skeletons, eliminating the need for conventional cleanroom technologies.
Design
Researchers Using Lidar and AI to Advance Transportation Engineering and Safety
University of Missouri engineering researchers are using advanced technology to help make our roads safer by better understanding how pedestrians, cyclists and vehicles interact.
Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security
Cycuity has collaborated with SiFive and BAE Systems to deliver increased, evidence-based security assurance for third-party intellectual property (IP) in a cost-effective and repeatable manner.
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
Today, Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member.
SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers
SK hynix Inc. announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.
Global Quantum Industry Revenue Topped $1.45 Billion in 2024
Revenue for the global quantum industry topped $1.45 billion in 2024 as quantum job openings surged and private quantum investments reached a record high
Smart Medical Devices: Connectivity Matters
Different connectivity options in three key functional elements of a remote patient monitoring device are evaluated to see which technology offers the most benefit to its users.
Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology
The physically aware, silicon-proven network-on-chip IP from Arteris supports the advancement of Nextchip’s next-generation vision technology products for the automotive industry.
FAMES Pilot Line Launches Open-Access Call
Initiated in December 2023 by the Chips Joint Undertaking (Chips JU) and coordinated by CEA-Leti, FAMES envisions a strategic leap in semiconductor innovation, while reinforcing Europe’s industrial leadership.
Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
Synopsys Inc. today announced the next phase of its work with NVIDIA to accelerate chip design up to 30x with the NVIDIA Grace Blackwell platform.
