Diamond is one of the most prized materials in advanced technologies due to its unmatched hardness, ability to conduct heat and capacity to host quantum-friendly defects.
Design
Wolfspeed Appoints Industry Veteran Dr. David Emerson as Chief Operating Officer
Wolfspeed, Inc. today announced that David Emerson, Ph.D. has been appointed Executive Vice President and Chief Operating Officer.
Global Semiconductor Forum Highlights Democratic Cooperation to Strengthen Supply Chain Resilience
To address rising geopolitical risks and global supply chain shifts, the Industrial Technology Research Institute (ITRI) hosted the Global Semiconductor Supply Chain Partnership Forum in Taipei on May 23.
sureCore Extends its sureFIT Design Service to Include Custom Memory Solutions for AI Applications
SureCore, a memory specialist, has announced the expansion of its sureFIT design service to include AI applications, using its memory design expertise to help AI chip developers achieve their complex power and performance goals.
Toshiba and Global Power Technology Accelerate Their Patent Filings on SiC Power Devices
According to data from our SiC Patent Monitor, power silicon carbide (SiC) technology saw robust patenting activity in Q1 2025, with over 840 new patent families filed globally.
Circuits Integrated Hellas Launches Game-Changing Kythrion Satcom Chipset
Circuits Integrated Hellas (CIH), an innovator in advanced satellite communication (Satcom) technology, today launched Kythrion, its chipset platform engineered to transform the satellite communications (Satcom) landscape.
SEMI North America Advisory Board Welcomes New Member From SACHEM, Inc.
SEMI today announced the election of a new member to the SEMI North America Advisory Board (NAAB), Rosemary Steen Hoffman, Chief Executive Officer, SACHEM, Inc., a supplier of high-purity, precision-based chemistries.
MIRA XR: New Ultra-High-Resolution SEM-EDS Solution by TESCAN GROUP
TESCAN GROUP introduces the MIRA XR, an ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis in academic research and quality control environments.
Curvilinear Technology: A Game Changer for the Logic Technology Roadmap
Imec enables the ‘curvilinear’ manufacturing ecosystem – from design over OPC and mask to wafer.
CHIPS Act and R&D – Who Will Pay for Leading Edge?
An increased investment in R&D is required, as well as a strategic rethinking of how existing manufacturing infrastructure can be modernized to meet future demands.
