The 2022 virtual Design and Verification Conference and Exhibition U.S. (DVCon U.S.), sponsored by Accellera Systems Initiative (Accellera), concluded its 34th annual event last week.
Design
New Research from Pusan National University Sheds Light on Nature of Friction in Multi-layered Graphene
New study provides insights into how surface structures influence nanoscale friction in this promising 2D material.
ASMC 2022 to Spotlight Advanced Semiconductor Manufacturing Excellence
Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will come into sharp focus at SEMI Advanced Semiconductor Manufacturing Conference.
Women in Semiconductors 2022 to Highlight Women in Leadership and STEM Talent Pipeline
The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 2 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2022) in Saratoga Springs, New York.
Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering
Breker Verification Systems used the opening of DVCon U.S. today to unveil SystemUVM, a framework designed to simplify specification model composition for test content synthesis with a UVM/SystemVerilog syntactic and semantic approach familiar to universal verification methodology (UVM) engineers.
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Silvaco Announces that Teledyne e2v Expands Adoption of its Victory TCAD Solution to Further Accelerate Development of CMOS Image Sensors
Silvaco Group, Inc., a provider of TCAD, EDA software, and Design IP, today announced that Teledyne e2v, a global leader in imaging solutions, has renewed its commitment to Silvaco’s Victory TCAD solution to accelerate its CMOS image sensor development.
Ferroelectric Devices Forge Ahead
At IEDM 2021 the new star of the emerging memory firmament was ferroelectric memories, either in 1T/1C (FeRAM) or 1T (FeFET) structures.
Movandi Collaborates With Qualcomm to Expand 5G mmWave Adoption
Movandi today announced that it has plans to collaborate with Qualcomm Technologies, Inc. to expand the adoption of 5G mmWave deployment for indoor and outdoor scenarios.
Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard.
