United Microelectronics Corporation, a global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
MEMS
Silicon Mitus and Pico Semiconductor Partner to Develop Ultra-Small High-Frequency Silicon Capacitors
Silicon Mitus’s ultra-small silicon capacitor is the result of its collaboration with Pico Semiconductor on analog semiconductor and cell manufacturing technology.
Worldwide Smartphone Shipments on Track for Recovery with a Slight Decline in the Third Quarter, According to IDC Tracker
Worldwide smartphone shipments declined 0.1% year over year to 302.8 million units in the third quarter of 2023 (3Q23), according to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.
MEMS Veteran, Matt Crowley, Joins Nanusens as Strategic Advisor
Nanusens has announced that Matt Crowley has joined the company as a strategic advisor.
STMicroelectronics’ Dual-Inline Silicon-Carbide Power Modules Offer Versatile Package Configurations for Automotive Applications
STMicroelectronics has released the ACEPACK DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive applications.
Dr. Rick Tsai to Receive Global Semiconductor Alliance’s Highest Honor, the Dr. Morris Chang Exemplary Leadership Award
Global Semiconductor Alliance (GSA) proudly announces it will honor Dr. Rick (Lih Shyng) Tsai, the CEO and Vice Chairman of MediaTek with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on December 7, 2023.
Dukosi and Suzhou Hengmei Electron Technology Strengthen Partnership and Establish Joint Development Laboratory
Dukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of battery systems, and Suzhou Hengmei Electron Technology, Inc. today announced the Joint Development Laboratory at Hengmei’s facility in Suzhou, China.
The 2024 IEEE VLSI Symposium on Technology & Circuits Announces Call for Papers
For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry.
SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era
The event, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and government.
KYOCERA AVX Provided Key Components for the Historic Chandrayaan-3 Lunar Mission
KYOCERA AVX contributed several components to the Pragyaan lunar rover, including stacked TCH Series surface-mount capacitors that became the first polymer capacitors to ever be used in a space mission.
