Worldwide call for applicants to qualify and win significant commercial and technical support from Arm.
Save the Date: Gordon Moore Tribute, June 1
An event to commemorate the life, work and legacy of Intel’s co-founder is planned for June 1.
With 7 Months Still to Go, Over 100 Exhibitors Confirmed for the UK’s Largest EV Event
The London EV Show is all set to be bigger and better than ever before, with the confirmation of over 100 exhibitors just a few months ahead of the event launch.
Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
Mitsubishi Electric Corporation announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module.
SEMI NBMC Invites Proposals for Wearable Sensor Innovations
The Nano-Bio Materials Consortium (NBMC), a SEMI Technology Community, today issued a Request for Proposals (RFP) aimed at advancing human performance through innovations in wearable transdermal, subcutaneous, and textile-based sensor technologies. Selected projects will receive cash awards ranging from $500,000 to $1 million.
InPlay Unveils World’s Smallest Bluetooth SoC in WLCSP Package
The new package, measuring an ultra-small 1.1mm x 2.0mm x 0.35mm, sets the record as the world’s smallest Bluetooth System on a Chip (SoC).
Global Semiconductor Sales Decrease 8.7% in First Quarter
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $119.5 billion during the first quarter of 2023, a decrease of 8.7% compared to the fourth quarter of 2022 and 21.3% less than the first quarter of 2022.
Leti Innovation Days Will Explore Microelectronics’ Role In Enabling Transformational Technologies on June 27-29
CEA-Leti research engineers, top executives at leading global companies and entrepreneurs will share insights about technological challenges and opportunities facing industry, government and society in coming years at Leti Innovations Days, June 27-29 in Grenoble, France.
New Toolchain and Software Package from STMicroelectronics Ease Development of Edge Processing With Intelligent Inertial Sensors
STMicroelectronics has released a toolchain and accompanying software package for programming the intelligent sensor processing unit embedded in the latest-generation intelligent MEMS IMUs.
Global Partnership Extends Purdue, State’s Reach as the Midwestern Hub of Semiconductor Innovation
Purdue University and the state of Indiana continue to make giant leaps in semiconductor research growth with a first-of-its-kind agreement with a cutting-edge European nano- and digital technology innovation hub.