New UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applications.
MEMS
SEMI and Semiconductor Digest Announce 2023 Best of West Award Finalists
SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco.
SEMICON West 2023 Opens Tomorrow to Showcase Industry Growth to $1 Trillion, Sustainability and Talent
Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations.
Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias
Applied Materials, Inc. today introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for heterogeneous integration (HI).
What’s in the July Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up your copy in print at SEMICON West in the publication bins and at the Semiconductor Digest Booth 1829.
New Study Shatters Conventional Wisdom and Unlocks the Future of Electrochemical Devices
A new study by researchers at the University of Cambridge reveals a surprising discovery that could transform the future of electrochemical devices.
ROHM’s New RGB Chip LED for Automotive Interiors Minimizes Color Variations Due to Color Mixing
ROHM Semiconductor today announced a new RGB chip LED (SMLVN6RGBFU) ideal for automotive interiors, such as function and status indicators in instrument clusters, CID (Center Information Displays) and accent lighting for footwells and door handles.
Researchers Grow Precise Arrays of NanoLEDs
A new technique produces perovskite nanocrystals right where they’re needed, so the exceedingly delicate materials can be integrated into nanoscale devices.
SkyWater CEO Thomas Sonderman to Deliver Keynote at SEMICON West
SkyWater Technology today announced its President and CEO, Thomas Sonderman will provide a keynote at SEMICON West 2023 on July 13th.
3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West
Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.
