MEMS

Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP

Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced the launch of Arteris FlexNoC 5 physically aware network-on-chip (NoC) interconnect IP.

Imec Demonstrates Low-Power Phase-Locked Loop for Short-Range Automotive and Industrial Radar Applications

Duty-cycled phase-locked loop enables fast generation of high-quality frequency-modulated signals relevant for 140GHz radar applications.

Qualcomm Expands Offering to Simplify and Accelerate IoT Across Multiple Industries

Qualcomm Technologies, Inc. today unveiled the Qualcomm Aware Platform, which empowers developers and enterprises to harness real-time information and data insights to accelerate their digital transformation programs.

Smart Flex Effector Makes Robots More Sensitive

Small component, significant impact: The Smart Flex Effector, a new, sensor-based compensation module from Bosch Rexroth, gives robots and Cartesian linear systems human-like sensitivity and thus offers new opportunities for factory automation.

Murata Introduces Next Generation LTE M/NB-IoT Module Solution

Murata, a manufacturer of electronics components and solutions, today announced its second generation LTE-M/NB-IoT module, the Type2GD.

Murata Introduces Next Generation LTE M/NB-IoT Module Solution

Murata today announced its second generation LTE-M/NB-IoT module, the Type2GD.

SEMI Europe Honors Melexis, Warsaw University of Technology and Centera Labs Leaders for Contributions to Semiconductor Industry

SEMI Europe today announced recipients of the European SEMI Award and Special Service Award for 2022 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2023). 

‘Lego-like’ Universal Connector Developed by NTU Singapore Scientists Makes Assembling Stretchable Devices a Snap

An international team led by researchers from Nanyang Technological University, Singapore (NTU Singapore) has developed a universal connector to assemble stretchable devices simply and quickly, in a ‘Lego-like’ manner.

Quantum Brilliance Secures $18 Million USD in Funding to Advance Miniaturized Quantum Computers

Quantum Brilliance, a developer of room-temperature miniaturized quantum computing products and solutions, today announced an $18 million USD fundraise.

SIA Urges Full Funding of CHIPS & Science Act Research Programs in President’s FY24 Budget

Semiconductor Industry Association (SIA) President and CEO John Neuffer today sent a letter to Office of Management and Budget Director Shalanda Young, encouraging her to include in the President’s Budget Request for Fiscal Year 2024 (FY24) full funding for research and workforce programs authorized by the CHIPS and Science Act of 2022.

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