SkyWater Technology today announced its President and CEO, Thomas Sonderman will provide a keynote at SEMICON West 2023 on July 13th.
MEMS
3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West
Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.
Oregon-based Rogue Valley Microdevices to Open Microfabrication Facility in Palm Bay
Company’s second pureplay MEMS fab creates 75 new high-tech jobs along Florida’s Space Coast.
Imec and ASML Sign MoU to Support Semiconductor Research and Sustainable Innovation in Europe
ASML is making a substantial commitment in imec’s future state-of-the-art pilot line.
Kyoto Semiconductor Announces 14 Reflective Sensor Products Using Near-Infrared Light
Kyoto Semiconductor Co., Ltd. has announced 14 products of SWIR*1 type reflective sensor “KPR series”.
NSF Invests $162M in Research Centers to Accelerate Materials Science from Lab to Factory
NSF backs nine Materials Research Science and Engineering Centers to create novel materials that can solve big challenges and enable the industries of tomorrow.
Researchers Make Major Strides Toward An All-Purpose Biosensor Chip
Detection across widely varying concentrations down to single-molecule could enable multiple medical tests to be performed on a single portable device.
Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development
Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships.
Sourceability Launches Digital Pricing Solution for Managing Excess Inventory
Sourceability, a global distributor of electronic components, today announced the launch of its Excess Inventory Estimator.
Extending Moore’s Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling
CEA-Leti and Intel today announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.
