Europe will be ready to grow again its market share but should maintain the current status quo and still source about 50% of production abroad.
MEMS
Singular Photonics Emerges from Stealth with Portfolio of SPAD-based Image Sensors
Singular Photonics emerged from stealth mode today, launching a new generation of image sensors based on single photon avalanche diodes (SPADs).
New Optical Memory Unit Poised to Improve Processing Speed and Efficiency
Fast, versatile volatile photonic memory could enhance AI, sensing and other computationally intense applications.
MACOM Signs Preliminary Memorandum of Terms for Federal CHIPS and Science Act Funding
Today, the Healey-Driscoll administration celebrated MACOM Technology Solutions Inc. (MACOM), the Lowell-based manufacturer that develops and supplies semiconductor components to the commercial and defense sectors, signing a preliminary memorandum of terms with the federal government for funding under the CHIPS for America program.
GF Piping Systems and Gradiant Partner Up to Drive Innovation for Sustainable Water Treatment
The collaboration aims to address the growing demands of the microelectronics and water industry, where precision, sustainability, and innovation are critical to success.
Alchip Opens 3DIC ASIC Design Services
Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications.
SiTime Precision Timing Enables New Architectures for More Efficient AI Datacenters
SiTime Corporation, the precision timing company, today announced the differential-ended SiT5977 Super-TCXO, the newest member of the SiTime Elite RF family.
Vertical Compute Raises €20 Million to Revolutionize the Future of AI Computing
VerticalCompute, founded by CEO Sylvain Dubois (ex-Google) and CTO Sebastien Couet (ex-imec), today announced that it successfully closed a seed investment round of €20 million.
Lam Research Establishes 28nm Pitch in High-Resolution Patterning Through Dry Photoresist Technology
Lam Research Corporation today announced that its innovative dry photoresist (dry resist) technology has been qualified for direct-print 28nm pitch back end of line (BEOL) logic at 2nm and below by imec, a research and innovation hub in nanoelectronics and digital technologies.
Powering the Future: SEOULTECH’s Breakthrough in Vibration Energy Harvesting
Researchers propose a novel design for electromagnetic induction type vibration energy harvesters, boosting efficiency and power output.
