Packaging

SEMI and Semiconductor Digest Announce 2023 Best of West Award Finalists

SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco.

SEMICON West 2023 Opens Tomorrow to Showcase Industry Growth to $1 Trillion, Sustainability and Talent

Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations.

Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias

Applied Materials, Inc. today introduced materials, technologies and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for heterogeneous integration (HI).

What’s in the July Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. Pick up your copy in print at SEMICON West in the publication bins and at the Semiconductor Digest Booth 1829.

ChipFlow Raises £1.2M in Pre-Seed Funding to Democratize Semiconductor Design Through Open-Source Software Tools

The oversubscribed financing round, which was led by Fontinalis Partners, includes participation from Fuel Ventures, InMotion Ventures, the investment arm of JLR, APX, and others.

3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West

Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.

Renesas and Wolfspeed Sign 10 Year Silicon Carbide Wafer Supply Agreement

The supply of high-quality silicon carbide wafers from Wolfspeed will pave the way for Renesas to scale production of silicon carbide power semiconductors starting in 2025.

IDTechEx Explores Materials and Processing for Advanced Semiconductor Packaging

Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements.

Microchip Launches $300M Multi-Year Investment Initiative to Expand its Presence in India

Includes funding for facilities, engineering labs, talent acquisition and support for regional technology consortia and educational institutions.

Semiconductor Market Extends Record Decline into Fifth Quarter

New research from Omdia reveals that the semiconductor market declined in revenue for a fifth straight quarter in the first quarter of 2023.

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