Packaging

Intel Plans Assembly and Test Facility in Poland

Investment near Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge manufacturing semiconductor value chain in Europe.

Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing

Intel makes new quantum chip available to university and federal research labs to grow the quantum computing research community.

Purdue University in Indianapolis: Launching Purdue’s First Comprehensive Urban Campus and Forming America’s Hard Tech Corridor

On June 14, 2023, Purdue University trustees and Indiana University trustees simultaneously approved the agreements that will effectively dissolve IUPUI on June 30, 2024, completing a process that started in August 2022.

Following All-Time Highs of 2022, Semiconductor Quartz Equipment Components Expected to be Down in 2023

TECHCET announced it expects a slight downturn in the Quartz components market, following an all-time high in 2022.

A Silicon Photonic Modulator Supporting the 800G Standard for High-Speed Data Transmission

In wireless communication, G stands for “generation” as in 4G, 5G, 6G. When it comes to data rate in optical communications though, “G” stands for gigabits per second (Gbps), and the progression doubles, as in 100G, 200G, 400G and 800G.

Toshiba Digital Solutions and Classiq to Collaborate on Gate-based Quantum Computing

Toshiba Digital Solutions Corporation and Classiq Technologies Ltd. signed a technology collaboration agreement in the gate-based quantum computing.

Amkor Advanced Packaging Enables the Car of the Future

Amkor Technology, Inc., a provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.

Introducing Lykos: Esmo Group’s BIB Loader/Unloader for the Semiconductor Industry

esmo group (esmo) announced the launch of its latest innovation, lykos, a modular Burn-in Board (BIB) loading and unloading system designed to eliminate manual placement and orientation errors.

Sivers Photonics Receives $1.3M Order from US Company for Custom Photonic Device Qualification

Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has received a new order worth $1.3M (approx. MSEK 14) for the qualification and supply of advanced photonic devices for optical sensing applications from a US-based customer.

Heraeus Electronics to Showcase Cutting-Edge Semiconductor Packaging Materials and Printed Electronics at SEMICON West

Heraeus Electronics announced its participation in SEMICON West, one of the most prominent global exhibitions for the semiconductor industry.

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