Packaging

StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences

StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March.

Magnachip Unveils Super-Short Channel MXT MOSFETs for Smartphone Battery Protection Circuit Modules

Magnachip Semiconductor Corporation announced today that the company has released two seventh-generation MXT MOSFETs.

JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar

JCET Group recently announced the company provides multiple customers with advanced packaging HVM solutions for 4D millimeter-wave Radar, to meet the increasingly diversified and customized demands of automotive electronic applications.

2023 CMC Conference Announces Lineup of Speakers

Featuring talks on current trends, issues, and new technologies for the semiconductor materials supply chain.

MITRE Engenuity and Semiconductor Alliance Position Paper Outlines Guidance for National Semiconductor Technology Center Incubation

Ensuring the United States improves its global competitiveness in semiconductors requires strategic deployment of the $52.7 billion in funding authorized in the CHIPS + Science Act.

Samsung, Micron, and SK Hynix Account for Three-Fourths of Leading-Edge Wafer Capacity

At the end of 2022, Samsung, Micron, and SK Hynix accounted for 76% of leading-edge capacity, with the vast majority of it for advanced DRAM and 3D NAND production.

ACM Research Receives Purchase Order for SAPS Tool from Major European Global Semiconductor Manufacturer

The tool is expected to be shipped to the prospective customer’s European facility in the fourth quarter of 2023.

NAB Show to Explore Next Generation of Content Delivery Systems

The NAB Show Broadcast Engineering and IT (BEIT) Conference will offer forward-focused insights into the technical issues, challenges and opportunities affecting the future of content delivery ecosystems.

STATS ChipPAC’s Automotive Millimeter Wave Radar Packaging Solution Receives Customer Award

STATS ChipPAC PTE. LTD. won the “Excellent Supplier Award of 2022” issued by Calterah.

indie Semiconductor Acquires Silicon Radar GmbH

indie Semiconductor, an Autotech solutions innovator has announced it has acquired Silicon Radar GmbH, a German-based specialist in advanced, highly integrated, high-frequency system-on-chips (SoCs) for automotive radar applications.

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