Scientists develop a meaningful approach to analyze how a material’s microstructure relates to its macroscopic physical properties.
Packaging
High Purity T-342 Diaphragm Valve Now Includes Sanitary Adapters Option
Asahi/America, Inc. now offers its T-342 diaphragm valves with optional sanitary adapter end connectors.
Henkel Non-Conductive Die Attach Film Offers Broad Wirebond Package Flexibility
Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs.
CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown
Advanced packaging and interconnect layers driving growth through ‘26.
After Record Sales in 2022, Semi Sales Forecast to Fall -5% in 2023
Collapsing memory prices and uncertain global economy weigh on next year’s growth.
Silicon Labs CEO Matt Johnson Elected Chair of Semiconductor Industry Association
Texas Instruments CEO Rich Templeton elected SIA Vice Chair.
Pfeiffer Vacuum Welcomes this Year’s Röntgen Prize Winner Dr. Victoria Grinberg
This year, the prestigious Röntgen Prize was awarded by the Justus Liebig University Giessen (JLU) to the astrophysicist and science advocate for her groundbreaking research in X-ray astronomy.
Why Is ASU a Major Player in Microelectronics?
University experts share insights on the technology driving our world.
ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters for e-Axle Using ROHM SiC Power Modules
ROHM Semiconductor today announced they have signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen Electric Industrial Co., Ltd., (Imasen) for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle.
Purdue University and GlobalFoundries Partner to Strengthen Research and Development, Semiconductor Education
Multifaceted collaboration to include joint R&D programs in partnership with Purdue students and faculty.
