Industry experts from across the electronics design and manufacturing supply chain will gather starting tomorrow at SEMICON Europa 2022 for the latest developments and trends across key semiconductor industry growth segments.
Packaging
After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound
Notably, the IC market has never shown more than three sequential quarters of decline.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors
Micron Technology, Inc. today announced availability of DDR5 memory for the data center that is validated for the new AMD EPYC 9004 Series processors.
ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications
ACM Research, Inc. today announced that it has expanded its Ultra C pr product offering to include metal lift-off (MLO) capabilities for power semiconductor manufacturing and wafer level packaging (WLP) applications.
Nexperia Invests in Sustainable Alternatives to Batteries
Nexperia, the expert in essential semiconductors, today announced a broadening to its portfolio of power management products to include energy harvesting solutions.
Trelleborg to Showcase Two New Isolast PureFab FFKM Materials at Semicon Europa 2022
Trelleborg Sealing Solutions showcases two new additions to its Isolast PureFab FFKM material range at Semicon Europa 2022 at Neue München, Munich, Germany, at booth number C1.842 from November 15 to 18.
Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA
Xiphera Ltd, a Finnish company designing and licensing cryptographic IP cores for FPGAs and ASICs, announced today that it has published a new white paper with Flex Logix.
ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia
The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
Ayar Labs Expands Executive Team to Lead the Next Phase of Growth in Optical I/O Production and Broad Commercial Adoption
Ayar Labs has expanded its executive team to further commercial development, with the addition of Lakshmikant (LK) Bhupathi, Vice President of Products, Strategy and Ecosystem, and Scott Clark, Vice President of Manufacturing and Operations.
Electrically Conductive Adhesive from Henkel Designed to Accommodate Compact Camera Module Complexity
Henkel continues to lead in consumer electronic material solutions and today announced its latest innovation, an electrically conductive adhesive (ECA) that cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).
