Lockheed Martin, (NYSE: LMT) and Ayar Labstoday announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the power of existing electrical I/O solutions.
Packaging
Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports
Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.
Pfeiffer Vacuum Components & Solutions Celebrates 25th Anniversary
This year, Pfeiffer Vacuum Components & Solutions GmbH in Göttingen is celebrating its 25th anniversary.
CHIPS Act Implementation Requires Strong Focus on “Advanced Packaging,” Industry Leaders Say
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve.
Aehr Announces New Advanced Testing Capabilities on its FOX-P Wafer Level Test & Burn-in Systems
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has released two new enhancements for its FOX-P family of wafer level test and burn-in systems.
Samsung Electronics Envisions Hyper-Growth in Memory and Logic Semiconductors through Intensified Industry Collaborations at Samsung Tech Day 2022
Samsung Electronics Co., Ltd. today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022.
Power Transistor Sales and ASP Will Both Increase 11% in 2022
Tight supplies, device shortages are driving up the average selling price of power transistors by the highest percentage since 2010, says update report.
Bosch Rexroth Announces Expansion in Factory Automation Capabilities
Bosch Rexroth is planning to expand its operations and will move its linear and assembly technology manufacturing facility to a new location in Charlotte, the company announced today.
Advantest Announces Call for Papers for VOICE 2023 Developer Conference in Santa Clara, California
Semiconductor test equipment supplier Advantest Corporation has issued an international call for papers for its VOICE 2023 Developer Conference focusing on leading-edge technologies and future trends.
Promex Expands Die Bonding Capacity, Adds New Capabilities
Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services.
