Packaging

Allegro MicroSystems Completes Acquisition of Heyday Integrated Circuits

Simplify and accelerate high-power GaN and SiC system implementation with revolutionary gate driver technology.

What’s in the August/September Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.

Supply Tightening Expected for Specialty Electronic Gases

Demand to outpace supply for NF3 and WF6 unless alternatives come into play.

GlobalFoundries Names Pradheepa Raman as Chief People Officer

GlobalFoundries today announced the appointment of Pradheepa Raman as Chief People Officer. The appointment is effective September 12, 2022. 

Sputtering Targets Driven by Robust Semiconductor Demand

Metal supply chains to face increased demand given broader chip applications.

SEMICON China 2022 to Highlight Sustainability, Smart Manufacturing and Advanced Packaging

With sustainability, smart manufacturing and advanced packaging key to the semiconductor industry’s profitable growth, SEMICON China 2022 will gather industry leaders and visionaries October 5-7 at the Shanghai New International Expo Centre for the latest insights on these and other critical topics for the electronics supply chain.

Henkel Opens Application Engineering Center for Electronics Applications in South China

Henkel announced the opening of its South China Application Engineering Center (SCAEC) in Dongguan, Guangdong Province.

Palomar Technologies Places Palomar 9000 Wedge Bonder with Bay Photonics for Advanced Photonics Applications

Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that Bay Photonics, an advanced photonics assembly, and packaging company has taken delivery of a Palomar 9000 Wedge Bonder as a requirement for meeting the demands for wedge-to-wedge bonding by their customers.

JCET Performance Hits Another Record High in 1H 2022

Today, JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, announced its financial results for the first half year of 2022.

North American Helium Successfully Brings Third Helium Facility into Production

Non-hydrocarbon sourced helium production from new facility contracted on long-term agreement with Air Liquide.

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