The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs.
Packaging
Akoustis Ships Second 5G Mobile Filter Design in its New Wafer-Level-Package to First Foundry Customer
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has completed the second design iteration of a 5G mobile filter and shipped samples to its first XBAW mobile foundry customer.
Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics.
Micron Announces $40 Billion Investment in Leading-Edge Memory Manufacturing in the US
Largest ever investment in U.S. memory manufacturing will create an estimated 40,000 American jobs, strengthen national security and bolster supply chain resilience.
GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028
Today’s announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility, in Malta, New York.
Nordson Corporation Announces Agreement to Acquire CyberOptics Corporation
The acquisition enhances Nordson’s test and inspection platform, providing differentiated technology that expands Nordson’s product offering in the semiconductor and electronics industries.
NEO Semiconductor Awarded “Best of Show” for Most Innovative Memory Technology
X-NAND Gen2 that enables 3D NAND flash memory with 20X faster write performance received top honors at Flash Memory Summit 2022.
Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
According to TrendForce research, Intel plans to outsource the tGPU chipset in Meteor Lake to TSMC for manufacture.
SkyWater Joins the American Semiconductor Innovation Coalition
Industry consortium proposes solutions for the National Semiconductor Technology Center and the National Advanced Packaging Manufacturing Program requested in the CHIPS+ Act.
IC Sales Turn Negative as Economy Weighs on Market
Never-before seen decline in June IC market driven by steep drop in memory pricing.
