InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.
Packaging
US/China Tension Must Be Seen in the Context of Taiwan’s TSMC’s Critical Role in the Global Semi Supply Chain
Following the news of raising tension between the US and China as a result of US House Speaker Nancy Pelosi recent visit to Taiwan; Josep Bori, Research Director in the Thematic team at GlobalData, a leading data and analytics company, offers his view.
Lip-Bu Tan, Executive Chairman of Cadence Design Systems and Chairman of Walden International, to Receive Semiconductor Industry’s Top Honor
Tan, renowned tech visionary and venture capital pioneer, will accept 2022 Robert N. Noyce Award during SIA Awards Dinner on Nov. 17.
SK hynix Develops World’s Highest 238-Layer 4D NAND Flash
SK hynix Inc. announced today that it has developed the industry’s highest 238-layer NAND Flash product.
Kioxia Launches Second Generation of High-Performance, Cost-Effective XL-FLASH Storage Class Memory Solution
Kioxia Corporation today announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency.
Partstat Partners with Major Financial Group to Provide Enhanced Inventory Financing Options to Manufacturers Amid Global Chip Shortage
Partstat, a unique inventory ownership solution provider, recently entered into a partnership agreement with one of the world’s leading financial groups.
Order for a New Production MBE Machine in Asia
RIBER is announcing an order for a MBE 6000 production system in Asia for a total amount of several million euros.
Strategic Materials Conference 2022 to Spotlight Innovations Paving the Way to $1 Trillion Semiconductor Industry
With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2022) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 3-5, 2022 at the DoubleTree by Hilton in San Jose, Calif.
3M and Nordson Introduce a New Automated Bonding System
This end-to-end bonding solution combines all the benefits of 3M VHB Tapes with the versatility of a liquid adhesive in a single contained footprint enabling usage on any scale.
JCET Begins Construction of a New High-End Manufacturing Base in Jiangyin
The “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project,” officially started construction of JCET’s new plant in Jiangyin City of Jiangsu province.
