Nepes Laweh Corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series fan-out technologies.
Packaging
Micron Appoints Rob Beard as SVP
Micron Technology, Inc. announced the appointment of Rob Beard as senior vice president, general counsel and corporate secretary.
GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply
GlobalFoundries Inc. (Nasdaq: GFS) (GF) today announced that it has agreed to amend its Wafer Supply Agreement (WSA) with AMD to increase the volume of chips GF will supply as well as extend the terms of the agreement to secure supply through 2025.
SEMICON Taiwan 2021 Opens Tomorrow with Smart and Green Manufacturing, Heterogeneous Integration and Compound Semiconductors in Focus
The latest advances in compound semiconductors, heterogeneous integration, smart manufacturing and green manufacturing will take center stage December 28-30 at SEMICON Taiwan 2021 as industry leaders and visionaries gather at the Nangang Exhibition Center, Hall I (TaiNEX 1) for the latest innovations and trends driving microelectronics industry growth.
inTEST Closes Acquisition of Acculogic
inTEST Corporation announced today that it has completed its acquisition of Acculogic, Inc. and its affiliates.
Navitas GaN ICs: Most Protected, Reliable and Robust Power Semiconductors for Mobile Fast Chargers
Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits (ICs) announced that its GaNFast power ICs with GaNSense technology have been upgraded to increase efficiency, power density, and access additional fast-charger markets.
Samsung Develops High-Performance PCIe 5.0 SSD for Enterprise Servers
Samsung Electronics Co., Ltd. today announced that it has developed the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung’s advanced sixth-generation V-NAND.
Applied Materials and A*STAR’s Institute of Microelectronics Expand Research Collaboration
Applied Materials, Inc. and the Institute of Microelectronics (IME), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR), today announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore.
17 Semiconductor Companies Forecast to Have >$10.0 Billion in Sales This Year
AMD, NXP, and Analog Devices are expected to join the ranks of the “megasuppliers” in 2021.
North American Semiconductor Equipment Industry Posts November 2021 Billings
The billings figure is 5.0% higher than final October 2021 billings of $3.74 billion and 50.6% higher than November 2020 billings of $2.61 billion.
